- Series:
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- Applications:
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- Operating Temperature:
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- Package / Case:
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- Size / Dimension:
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- Height:
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- Capacitance:
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- ESR (Equivalent Series Resistance):
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- ESL (Equivalent Series Inductance):
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- Condizioni selezionate:
Scopri i prodotti 215
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Applications | Operating Temperature | Package / Case | Features | Tolerance | Size / Dimension | Height | Capacitance | ESR (Equivalent Series Resistance) | Voltage - Breakdown | ESL (Equivalent Series Inductance) | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Applications | Operating Temperature | Package / Case | Features | Tolerance | Size / Dimension | Height | Capacitance | ESR (Equivalent Series Resistance) | Voltage - Breakdown | ESL (Equivalent Series Inductance) | ||
M/A-Com Technology Solutions |
800
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 15PF 100V SMD
|
Tray | - | High Stability | -55°C ~ 150°C | Nonstandard Chip | High Reliability | - | 0.020" L x 0.020" W (0.51mm x 0.51mm) | - | 15pF | - | - | - | ||||
M/A-Com Technology Solutions |
800
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 9.9PF 10% 100V SMD
|
Tray - Waffle | 91 | High Stability | -55°C ~ 150°C | Nonstandard Chip | High Reliability | ±10% | 0.015" L x 0.015" W (0.38mm x 0.38mm) | 0.005" (0.13mm) | 9.9pF | - | - | - | ||||
M/A-Com Technology Solutions |
800
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 12PF 10% 100V SMD
|
Tray - Waffle | 91 | High Stability | -55°C ~ 150°C | Nonstandard Chip | High Reliability | ±10% | 0.020" L x 0.020" W (0.51mm x 0.51mm) | 0.006" (0.15mm) | 12pF | - | - | - | ||||
M/A-Com Technology Solutions |
800
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 100PF 10% 50V SMD
|
Tray - Waffle | 90 | High Stability | -55°C ~ 150°C | Nonstandard Chip | High Reliability | ±10% | 0.040" L x 0.040" W (1.02mm x 1.02mm) | 0.010" (0.25mm) | 100pF | - | 50V | - | ||||
M/A-Com Technology Solutions |
200
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 6PF 20% 50V SMD
|
Tray - Waffle | 90 | High Stability | -55°C ~ 150°C | Nonstandard Chip | High Reliability | ±20% | 0.010" L x 0.010" W (0.25mm x 0.25mm) | 0.005" (0.13mm) | 6pF | - | - | - | ||||
IPDiA |
1,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 470PF 15% 11V 0402
|
Tape & Reel (TR) | HTSC | High Temperature | -55°C ~ 200°C | 0402 (1005 Metric) | High Reliability | ±15% | 0.047" L x 0.028" W (1.20mm x 0.70mm) | 0.016" (0.41mm) | 470pF | 400 mOhms | 11V | 100pH | ||||
IPDiA |
99
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 470PF 15% 11V 0402
|
Cut Tape (CT) | HTSC | High Temperature | -55°C ~ 200°C | 0402 (1005 Metric) | High Reliability | ±15% | 0.047" L x 0.028" W (1.20mm x 0.70mm) | 0.016" (0.41mm) | 470pF | 400 mOhms | 11V | 100pH | ||||
IPDiA |
1,099
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 470PF 15% 11V 0402
|
- | HTSC | High Temperature | -55°C ~ 200°C | 0402 (1005 Metric) | High Reliability | ±15% | 0.047" L x 0.028" W (1.20mm x 0.70mm) | 0.016" (0.41mm) | 470pF | 400 mOhms | 11V | 100pH | ||||
IPDiA |
141
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 10000PF 15% 11V 0402
|
Cut Tape (CT) | HSSC | High Stability | -55°C ~ 150°C | 0402 (1005 Metric) | High Reliability | ±15% | 0.047" L x 0.028" W (1.20mm x 0.70mm) | 0.016" (0.41mm) | 10000pF | 400 mOhms | 11V | 100pH | ||||
IPDiA |
1,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 0.033UF 15% 11V 0402
|
Tape & Reel (TR) | HSSC | High Stability | -55°C ~ 150°C | 0402 (1005 Metric) | High Reliability | ±15% | 0.047" L x 0.028" W (1.20mm x 0.70mm) | 0.016" (0.41mm) | 0.033μF | 400 mOhms | 11V | 100pH | ||||
IPDiA |
46
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 0.033UF 15% 11V 0402
|
Cut Tape (CT) | HSSC | High Stability | -55°C ~ 150°C | 0402 (1005 Metric) | High Reliability | ±15% | 0.047" L x 0.028" W (1.20mm x 0.70mm) | 0.016" (0.41mm) | 0.033μF | 400 mOhms | 11V | 100pH | ||||
IPDiA |
1,046
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 0.033UF 15% 11V 0402
|
- | HSSC | High Stability | -55°C ~ 150°C | 0402 (1005 Metric) | High Reliability | ±15% | 0.047" L x 0.028" W (1.20mm x 0.70mm) | 0.016" (0.41mm) | 0.033μF | 400 mOhms | 11V | 100pH | ||||
IPDiA |
989
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 0.022UF 15% 11V 0402
|
Cut Tape (CT) | HSSC | High Stability | -55°C ~ 150°C | 0402 (1005 Metric) | High Reliability | ±15% | 0.047" L x 0.028" W (1.20mm x 0.70mm) | 0.016" (0.41mm) | 0.022μF | 400 mOhms | 11V | 100pH | ||||
IPDiA |
1,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 0.033UF 15% 11V 0402
|
Tape & Reel (TR) | HTSC | High Temperature | -55°C ~ 200°C | 0402 (1005 Metric) | High Reliability | ±15% | 0.047" L x 0.028" W (1.20mm x 0.70mm) | 0.016" (0.41mm) | 0.033μF | 400 mOhms | 11V | 100pH | ||||
IPDiA |
100
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 0.033UF 15% 11V 0402
|
Cut Tape (CT) | HTSC | High Temperature | -55°C ~ 200°C | 0402 (1005 Metric) | High Reliability | ±15% | 0.047" L x 0.028" W (1.20mm x 0.70mm) | 0.016" (0.41mm) | 0.033μF | 400 mOhms | 11V | 100pH | ||||
IPDiA |
1,100
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 0.033UF 15% 11V 0402
|
- | HTSC | High Temperature | -55°C ~ 200°C | 0402 (1005 Metric) | High Reliability | ±15% | 0.047" L x 0.028" W (1.20mm x 0.70mm) | 0.016" (0.41mm) | 0.033μF | 400 mOhms | 11V | 100pH | ||||
IPDiA |
394
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 0.1UF 15% 11V 0603
|
Cut Tape (CT) | HSSC | High Stability | -55°C ~ 150°C | 0603 (1608 Metric) | High Reliability | ±15% | 0.071" L x 0.043" W (1.80mm x 1.10mm) | 0.016" (0.41mm) | 0.1μF | 400 mOhms | 11V | 100pH | ||||
M/A-Com Technology Solutions |
400
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 10PF 10% 50V SMD
|
Tray - Waffle | 90 | High Stability | -55°C ~ 150°C | Nonstandard Chip | High Reliability | ±10% | 0.010" L x 0.010" W (0.25mm x 0.25mm) | 0.007" (0.18mm) | 10pF | - | 50V | - | ||||
IPDiA |
948
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 0.1UF 15% 11V 0805
|
Cut Tape (CT) | HSSC | High Stability | -55°C ~ 150°C | 0805 (2012 Metric) | High Reliability | ±15% | 0.087" L x 0.055" W (2.20mm x 1.40mm) | 0.016" (0.41mm) | 0.1μF | 400 mOhms | 11V | 100pH | ||||
IPDiA |
897
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CAP SILICON 0.047UF 15% 11V 0402
|
Cut Tape (CT) | HSSC | High Stability | -55°C ~ 150°C | 0402 (1005 Metric) | High Reliability | ±15% | 0.047" L x 0.028" W (1.20mm x 0.70mm) | 0.016" (0.41mm) | 0.047μF | 400 mOhms | 11V | 100pH |