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Scopri i prodotti 28,900
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Function | Voltage - Supply | Operating Temperature | Package / Case | Output | Mounting Type | Type | Size / Dimension | Ratings | Height | Frequency Stability | Current - Supply (Max) | Programmable Type | Available Frequency Range | Frequency Stability (Total) | Spread Spectrum Bandwidth | |
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Function | Voltage - Supply | Operating Temperature | Package / Case | Output | Mounting Type | Type | Size / Dimension | Ratings | Height | Frequency Stability | Current - Supply (Max) | Programmable Type | Available Frequency Range | Frequency Stability (Total) | Spread Spectrum Bandwidth | |
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Abracon LLC |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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OSC MEMS 7.0X5.0 CMOS BLANK
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Tape & Reel (TR) | Pure Silicon ASVMP | Enable/Disable | 2.25 V ~ 3.6 V | -40°C ~ 105°C | 6-VDFN Exposed Pad | CMOS | Surface Mount | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | - | 0.035" (0.90mm) | - | 35mA | Blank (User Must Program) | 2.3MHz ~ 170MHz | ±25ppm | - | ||
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Abracon LLC |
428
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3 giorni |
-
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MOQ: 1 MPQ: 1
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OSC MEMS 7.0X5.0 CMOS BLANK
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Cut Tape (CT) | Pure Silicon ASVMP | Enable/Disable | 2.25 V ~ 3.6 V | -40°C ~ 105°C | 6-VDFN Exposed Pad | CMOS | Surface Mount | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | - | 0.035" (0.90mm) | - | 35mA | Blank (User Must Program) | 2.3MHz ~ 170MHz | ±25ppm | - | ||
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Abracon LLC |
428
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3 giorni |
-
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MOQ: 1 MPQ: 1
|
OSC MEMS 7.0X5.0 CMOS BLANK
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- | Pure Silicon ASVMP | Enable/Disable | 2.25 V ~ 3.6 V | -40°C ~ 105°C | 6-VDFN Exposed Pad | CMOS | Surface Mount | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | - | 0.035" (0.90mm) | - | 35mA | Blank (User Must Program) | 2.3MHz ~ 170MHz | ±25ppm | - | ||
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SiTime |
75
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3 giorni |
-
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MOQ: 1 MPQ: 1
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OSC PROGR LVDS DIFF 7050
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Bulk | SiT9122 | Enable/Disable，Standby | 2.5V，3.3V | -40°C ~ 85°C，-20°C ~ -40°C | 6-SMD，No Lead | LVDS | Surface Mount | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | - | 0.039" (1.00mm) | ±20ppm | 55mA | Blank (User Must Program) | 220MHz ~ 625MHz | - | - | ||
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Abracon LLC |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
OSC MEMS 7.0X5.0 LVDS BLANK
|
Tape & Reel (TR) | Pure Silicon ASVMP | Enable/Disable | 2.25 V ~ 3.6 V | -40°C ~ 105°C | 6-VDFN Exposed Pad | LVDS | Surface Mount | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | - | 0.035" (0.90mm) | - | 32mA | Blank (User Must Program) | 2.3MHz ~ 460MHz | ±25ppm | - | ||
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Abracon LLC |
278
|
3 giorni |
-
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MOQ: 1 MPQ: 1
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OSC MEMS 7.0X5.0 LVDS BLANK
|
Cut Tape (CT) | Pure Silicon ASVMP | Enable/Disable | 2.25 V ~ 3.6 V | -40°C ~ 105°C | 6-VDFN Exposed Pad | LVDS | Surface Mount | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | - | 0.035" (0.90mm) | - | 32mA | Blank (User Must Program) | 2.3MHz ~ 460MHz | ±25ppm | - | ||
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Abracon LLC |
278
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
OSC MEMS 7.0X5.0 LVDS BLANK
|
- | Pure Silicon ASVMP | Enable/Disable | 2.25 V ~ 3.6 V | -40°C ~ 105°C | 6-VDFN Exposed Pad | LVDS | Surface Mount | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | - | 0.035" (0.90mm) | - | 32mA | Blank (User Must Program) | 2.3MHz ~ 460MHz | ±25ppm | - | ||
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SiTime |
41
|
3 giorni |
-
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MOQ: 1 MPQ: 1
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OSC PGM 80MHZ - 220MHZ SMD
|
Bulk | SiT3809 | Enable/Disable，Standby | 1.8V，2.5 V ~ 3.3 V | -40°C ~ 85°C，-20°C ~ -40°C | 6-SMD，No Lead | LVCMOS | Surface Mount | MEMS VCXO | 0.197" L x 0.126" W (5.00mm x 3.20mm) | - | 0.031" (0.79mm) | ±10ppm | 36mA | Blank (User Must Program) | 80MHz ~ 220MHz | - | - | ||
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Microchip Technology |
875
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
MEMS OSC UNPROGRAM 50PPM 4VDFN
|
Tube | DSC8002 | Standby | 1.8 V ~ 3.3 V | -40°C ~ 85°C | 4-SMD，No Lead | CMOS | Surface Mount | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | 0.035" (0.90mm) | ±50ppm | 10mA | Blank (User Must Program) | 1MHz ~ 150MHz | - | - | ||
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Microchip Technology |
304
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 CMOS
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Tube | DSC8002 | Standby | 1.8 V ~ 3.3 V | -40°C ~ 85°C | 4-SMD，No Lead | CMOS | Surface Mount | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | 0.035" (0.90mm) | - | 10mA | Blank (User Must Program) | 1MHz ~ 150MHz | ±25ppm | - | ||
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Microchip Technology |
575
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
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OSC MEMS BLANK 2.5X2.0 CMOS
|
Tube | DSC8001 | Standby | 1.8 V ~ 3.3 V | -40°C ~ 85°C | 4-SMD，No Lead | CMOS | Surface Mount | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | AEC-Q100 | 0.035" (0.90mm) | - | 12.2mA | Blank (User Must Program) | 1MHz ~ 150MHz | ±50ppm | - | ||
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Microchip Technology |
151
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 7.0X5.0 CMOS
|
Tube | DSC8001 | Standby | 1.8 V ~ 3.3 V | -40°C ~ 85°C | 4-SMD，No Lead | CMOS | Surface Mount | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | AEC-Q100 | 0.035" (0.90mm) | - | 12.2mA | Blank (User Must Program) | 1MHz ~ 150MHz | ±25ppm | - | ||
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Microchip Technology |
648
|
3 giorni |
-
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MOQ: 1 MPQ: 1
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MEMS OSC UNPROGRAM 25PPM 4VDFN
|
Tube | DSC8001 | Standby | 1.8 V ~ 3.3 V | -40°C ~ 105°C | 4-SMD，No Lead Exposed Pad | CMOS | Surface Mount | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | AEC-Q100 | 0.035" (0.90mm) | ±25ppm | 12.2mA | Blank (User Must Program) | 1MHz ~ 150MHz | - | - | ||
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Microchip Technology |
183
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 CMOS
|
Tube | DSC8001 | Standby | 1.8 V ~ 3.3 V | -40°C ~ 105°C | 4-SMD，No Lead | CMOS | Surface Mount | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | AEC-Q100 | 0.035" (0.90mm) | - | 12.2mA | Blank (User Must Program) | 1MHz ~ 150MHz | ±10ppm | - | ||
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Microchip Technology |
87
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 5.0X3.2 CMOS
|
Tube | DSC8001 | Standby | 1.8 V ~ 3.3 V | -40°C ~ 105°C | 4-SMD，No Lead | CMOS | Surface Mount | MEMS (Silicon) | 0.197" L x 0.126" W (5.00mm x 3.20mm) | AEC-Q100 | 0.035" (0.90mm) | - | 12.2mA | Blank (User Must Program) | 1MHz ~ 150MHz | ±10ppm | - | ||
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Microchip Technology |
418
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 2.5X2.0 CMOS
|
Tube | DSC8001 | Standby | 1.8 V ~ 3.3 V | -40°C ~ 105°C | 4-SMD，No Lead | CMOS | Surface Mount | MEMS (Silicon) | 0.098" L x 0.079" W (2.50mm x 2.00mm) | AEC-Q100 | 0.035" (0.90mm) | - | 12.2mA | Blank (User Must Program) | 1MHz ~ 150MHz | ±10ppm | - | ||
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Microchip Technology |
45
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 7.0X5.0 CMOS
|
Tube | DSC8101 | Standby | 2.25 V ~ 3.6 V | -40°C ~ 85°C | 6-SMD，No Lead | CMOS | Surface Mount | MEMS (Silicon) | 0.276" L x 0.197" W (7.00mm x 5.00mm) | - | 0.035" (0.90mm) | - | 35mA | Blank (User Must Program) | 10MHz ~ 170MHz | ±25ppm | - | ||
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|
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Microchip Technology |
876
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 CMOS
|
Tube | DSC8121 | Enable/Disable | 2.25 V ~ 3.6 V | -55°C ~ 125°C | 6-SMD，No Lead | CMOS | Surface Mount | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | 0.035" (0.90mm) | - | 35mA | Blank (User Must Program) | 10MHz ~ 170MHz | ±50ppm | - | ||
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Microchip Technology |
880
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 CMOS
|
Tube | DSC8002 | Standby | 1.8 V ~ 3.3 V | 0°C ~ 70°C | 4-SMD，No Lead | CMOS | Surface Mount | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | - | 0.035" (0.90mm) | - | 10mA | Blank (User Must Program) | 1MHz ~ 150MHz | ±50ppm | - | ||
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|
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Microchip Technology |
400
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
OSC MEMS BLANK 3.2X2.5 CMOS
|
Tube | DSC8001 | Standby | 1.8 V ~ 3.3 V | -40°C ~ 85°C | 4-SMD，No Lead | CMOS | Surface Mount | MEMS (Silicon) | 0.126" L x 0.098" W (3.20mm x 2.50mm) | AEC-Q100 | 0.035" (0.90mm) | - | 12.2mA | Blank (User Must Program) | 1MHz ~ 150MHz | ±50ppm | - |
