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Scopri i prodotti 678
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Mounting Type | Type | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Mounting Type | Type | ||
Microchip Technology |
340
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:5 2GHZ 32MLF
|
Tray | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad,32-MLF? | 32-MLF? (5x5) | CML,LVDS,PECL | 1 | 0.08680555555555557 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
Microchip Technology |
182
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:6 3GHZ 32MLF
|
Tube | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad,32-MLF? | 32-MLF? (5x5) | CML,LVDS,PECL | 1 | 0.08750000000000001 | Yes/Yes | 3GHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
Microchip Technology |
469
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:4 2GHZ 16MLF
|
Tube | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad,16-MLF? | 16-MLF? (3x3) | CML,LVDS,LVPECL | 1 | 0.04444444444444445 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution),Translator | ||||
Microchip Technology |
216
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:4 1GHZ 16MLF
|
Tube | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad,16-MLF? | 16-MLF? (3x3) | LVCMOS,LVTTL | 1 | 0.08611111111111112 | No/Yes | 1GHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer,Translator | ||||
ON Semiconductor |
110
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:2 4GHZ 16QFN
|
Tube | ECLinPS MAX | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-QFN (3x3) | CML,LVCMOS,LVDS,LVPECL,LVTTL | 1 | 0.04305555555555556 | Yes/Yes | 4GHz | Surface Mount | Fanout Buffer (Distribution) | ||||
Microchip Technology |
142
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:8 2GHZ 32MLF
|
Tube | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad,32-MLF? | 32-MLF? (5x5) | CML,LVDS,PECL | 1 | 0.08888888888888889 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
Microchip Technology |
253
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:3 2.5GHZ 16MLF
|
Tube | Precision Edge | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad,16-MLF? | 16-MLF? (3x3) | CML,HSTL,LVDS,LVPECL | 1 | 0.04375 | Yes/Yes | 2.5GHz | Surface Mount | Fanout Buffer (Distribution),Divider | ||||
Microchip Technology |
240
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:2 5GHZ 16MLF
|
Tube | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad,16-MLF? | 16-MLF? (3x3) | CML,LVDS,LVPECL | 1 | 0.04305555555555556 | Yes/Yes | 5GHz | Surface Mount | Fanout Buffer (Distribution),Translator | ||||
Microchip Technology |
164
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:8 4GHZ 32MLF
|
Tube | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad,32-MLF? | 32-MLF? (5x5) | CML,LVDS,LVPECL | 1 | 0.04722222222222222 | Yes/Yes | 4GHz | Surface Mount | Fanout Buffer (Distribution) | ||||
Microchip Technology |
211
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:6 7GHZ 32MLF
|
Tube | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad,32-MLF? | 32-MLF? (5x5) | CML,LVDS,PECL | 1 | 0.08750000000000001 | Yes/Yes | 7GHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
IDT,Integrated Device Technology Inc |
200
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MUX 2:1 DIFF-LVPECL 16TSSOP
|
Tube | - | 2.375 V ~ 3.465 V | -40°C ~ 85°C | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | CML,LVDS,LVPECL | 1 | 0.08402777777777777 | Yes/Yes | 2.5GHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
IDT,Integrated Device Technology Inc |
745
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK MULTPX 12:1 32VFQFN
|
Tray | - | 2.375 V ~ 3.465 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) | CML,LVDS,LVPECL,SSTL | 1 | 0.5006944444444444 | Yes/Yes | 3.2GHz | Surface Mount | Multiplexer,Data | ||||
IDT,Integrated Device Technology Inc |
464
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:16 500MHZ 48TQFP
|
Tray | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 48-LQFP | 48-LQFP (7x7) | HCSL,LVDS,LVHSTL,LVPECL,SSTL | 1 | 0.05277777777777778 | Yes/Yes | 500MHz | Surface Mount | Fanout Buffer (Distribution) | ||||
IDT,Integrated Device Technology Inc |
213
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:24 1.5GHZ 64TQFP
|
Tray | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 64-TQFP Exposed Pad | 64-TQFP-EP (10x10) | HCSL,LVDS,LVHSTL,LVPECL,SSTL | 1 | 0.05833333333333333 | Yes/Yes | 1.5GHz | Surface Mount | Fanout Buffer (Distribution) | ||||
Microchip Technology |
131
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK MULTIPLXR 2:10 2GHZ 44MLF
|
Tray | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 44-VFQFN Exposed Pad,44-MLF? | 44-MLF? (7x7) | CML,LVDS,PECL | 1 | 0.09027777777777778 | Yes/Yes | 2GHz | Surface Mount | Multiplexer | ||||
Microchip Technology |
1,002
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:22 2GHZ 64TQFP
|
Tray | Precision Edge | 2.37 V ~ 3.6 V | -40°C ~ 85°C | 64-TQFP Exposed Pad | 64-EP-TQFP | LVDS,LVPECL | 1 | 0.09861111111111111 | Yes/Yes | 2GHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer,Translator | ||||
IDT,Integrated Device Technology Inc |
241
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:9 500MHZ 32TQFP
|
Tray | - | 3.135 V ~ 3.465 V | 0°C ~ 70°C | 32-LQFP | 32-TQFP (7x7) | CML,HCSL,LVDS,LVHSTL,LVPECL,SSTL | 1 | 0.08958333333333333 | Yes/Yes | 500MHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
IDT,Integrated Device Technology Inc |
367
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUF 1:12 1.5GHZ 32VFQFPN
|
Tray | - | 2.375 V ~ 3.465 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VFQFPN (5x5) | CML,LVPECL,SSTL | 1 | 0.05 | Yes/Yes | 1.5GHz | Surface Mount | Fanout Buffer (Distribution) | ||||
Microchip Technology |
2,500
|
3 giorni |
-
|
MOQ: 2500 MPQ: 1
|
IC CLK BUFFER 2:4 1GHZ 20TSSOP
|
Tape & Reel (TR) | - | 2.375 V ~ 3.63 V | 0°C ~ 70°C | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | CML,HCSL,LVCMOS,LVDS,LVHSTL,LVPECL,SSTL | 1 | 0.08611111111111112 | Yes/Yes | 1GHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer | ||||
Microchip Technology |
2,662
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:4 1GHZ 20TSSOP
|
Cut Tape (CT) | - | 2.375 V ~ 3.63 V | 0°C ~ 70°C | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | CML,HCSL,LVCMOS,LVDS,LVHSTL,LVPECL,SSTL | 1 | 0.08611111111111112 | Yes/Yes | 1GHz | Surface Mount | Fanout Buffer (Distribution),Multiplexer |