- Packaging:
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- Voltage - Supply:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Ratio - Input:Output:
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- Differential - Input:Output:
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- Frequency - Max:
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- Condizioni selezionate:
Scopri i prodotti 22
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Type | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Number of Circuits | Ratio - Input:Output | Differential - Input:Output | Frequency - Max | Type | ||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 194 MPQ: 1
|
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
Tube | 2.375 V ~ 3.8 V | -40°C ~ 85°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | ECL | 1 | 0.04305555555555556 | Yes/Yes | 3GHz | Fanout Buffer (Distribution) | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC CLK BUFFER 1:2 3GHZ 8SOIC
|
Tape & Reel (TR) | 2.375 V ~ 3.8 V | -40°C ~ 85°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | ECL | 1 | 0.04305555555555556 | Yes/Yes | 3GHz | Fanout Buffer (Distribution) | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 100 MPQ: 1
|
IC CLK BUFFER 1:2 3GHZ 8TSSOP
|
Tube | 2.375 V ~ 3.8 V | -40°C ~ 85°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-TSSOP | ECL | 1 | 0.04305555555555556 | Yes/Yes | 3GHz | Fanout Buffer (Distribution) | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC CLK BUFFER 1:2 3GHZ 8TSSOP
|
Tape & Reel (TR) | 2.375 V ~ 3.8 V | -40°C ~ 85°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-TSSOP | ECL | 1 | 0.04305555555555556 | Yes/Yes | 3GHz | Fanout Buffer (Distribution) | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 96 MPQ: 1
|
IC CLK BUFFER 2:4 2GHZ 16TSSOP
|
Tube | 2.375 V ~ 3.8 V | -40°C ~ 85°C | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | HSTL,LVPECL | 1 | 0.08611111111111112 | Yes/Yes | 2GHz | Fanout Buffer (Distribution),Multiplexer | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC CLK BUFFER 2:4 2GHZ 16TSSOP
|
Tape & Reel (TR) | 2.375 V ~ 3.8 V | -40°C ~ 85°C | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | HSTL,LVPECL | 1 | 0.08611111111111112 | Yes/Yes | 2GHz | Fanout Buffer (Distribution),Multiplexer | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC CLK BUFFER 1:10 1GHZ 52PTQFP
|
Tray | 2.375 V ~ 3.465 V | 0°C ~ 70°C | 52-LQFP Exposed Pad | 52-PTQFP (10x10) | ECL,PECL | 2 | 0.04861111111111111 | Yes/Yes | 1GHz | Fanout Buffer (Distribution) | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 1500 MPQ: 1
|
IC CLK BUFFER 1:10 1GHZ 52PTQFP
|
Tape & Reel (TR) | 2.375 V ~ 3.465 V | 0°C ~ 70°C | 52-LQFP Exposed Pad | 52-PTQFP (10x10) | ECL,PECL | 2 | 0.04861111111111111 | Yes/Yes | 1GHz | Fanout Buffer (Distribution) | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 160 MPQ: 1
|
IC CLK BUFFER 2:15 3GHZ 52PTQFP
|
Tray | 2.375 V ~ 3.465 V | -40°C ~ 110°C | 52-LQFP Exposed Pad | 52-PTQFP (10x10) | ECL,PECL | 1 | 0.09375 | Yes/Yes | 3GHz | Fanout Buffer (Distribution),Divider,Multiplexer,PLL | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 1500 MPQ: 1
|
IC CLK BUFFER 2:15 3GHZ 52PTQFP
|
Tape & Reel (TR) | 2.375 V ~ 3.465 V | -40°C ~ 110°C | 52-LQFP Exposed Pad | 52-PTQFP (10x10) | ECL,PECL | 1 | 0.09375 | Yes/Yes | 3GHz | Fanout Buffer (Distribution),Divider,Multiplexer,PLL | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 250 MPQ: 1
|
IC CLK BUFFER 1:9 3GHZ 32TQFP
|
Tray | 2.375 V ~ 3.465 V | 0°C ~ 110°C | 32-LQFP | 32-TQFP (7x7) | LVCMOS,LVPECL | 1 | 0.04791666666666666 | Yes/Yes | 3GHz | Fanout Buffer (Distribution),Divider | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC CLK BUFFER 1:9 3GHZ 32TQFP
|
Tape & Reel (TR) | 2.375 V ~ 3.465 V | 0°C ~ 110°C | 32-LQFP | 32-TQFP (7x7) | LVCMOS,LVPECL | 1 | 0.04791666666666666 | Yes/Yes | 3GHz | Fanout Buffer (Distribution),Divider | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 250 MPQ: 1
|
IC CLK BUFFER 2:6 3GHZ 32TQFP
|
Tray | 2.375 V ~ 3.465 V | 0°C ~ 70°C | 32-LQFP | 32-TQFP (7x7) | LVCMOS,LVPECL | 1 | 0.08750000000000001 | Yes/Yes | 3GHz | Fanout Buffer (Distribution),Multiplexer | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 2000 MPQ: 1
|
IC CLK BUFFER 2:6 3GHZ 32TQFP
|
Tape & Reel (TR) | 2.375 V ~ 3.465 V | 0°C ~ 70°C | 32-LQFP | 32-TQFP (7x7) | LVCMOS,LVPECL | 1 | 0.08750000000000001 | Yes/Yes | 3GHz | Fanout Buffer (Distribution),Multiplexer | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 148 MPQ: 1
|
IC CLK BUFFER 2:4 1GHZ 20TSSOP
|
Tube | 3.135 V ~ 3.8 V | -40°C ~ 85°C | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | LVCMOS,LVTTL | 1 | 0.08611111111111112 | No/Yes | 1GHz | Fanout Buffer (Distribution),Multiplexer | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC CLK BUFFER 2:4 1GHZ 20TSSOP
|
Tape & Reel (TR) | 3.135 V ~ 3.8 V | -40°C ~ 85°C | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | LVCMOS,LVTTL | 1 | 0.08611111111111112 | No/Yes | 1GHz | Fanout Buffer (Distribution),Multiplexer | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 250 MPQ: 1
|
IC CLK BUFFER 2:3 3GHZ 32LQFP
|
Tray | 2.375 V ~ 3.465 V | -40°C ~ 110°C | 32-LQFP | 32-LQFP (7x7) | LVCMOS,LVPECL | 2 | 0.08541666666666665 | Yes/Yes | 3GHz | Fanout Buffer (Distribution),Multiplexer | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 96 MPQ: 1
|
IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
|
Tube | 2.375 V ~ 3.8 V | -40°C ~ 85°C | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | HSTL,LVPECL | 1 | 0.08611111111111112 | Yes/Yes | 2.5GHz | Fanout Buffer (Distribution),Multiplexer | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 250 MPQ: 1
|
IC CLK BUFFER 2:3 3GHZ 32LQFP
|
Tray | 2.375 V ~ 3.465 V | -40°C ~ 110°C | 32-LQFP | 32-LQFP (7x7) | LVCMOS,LVPECL | 2 | 0.08541666666666665 | Yes/Yes | 3GHz | Fanout Buffer (Distribution),Multiplexer | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 75 MPQ: 1
|
IC CLK BUFFER 2:4 1GHZ 20TSSOP
|
Tube | 3.135 V ~ 3.8 V | -40°C ~ 85°C | 20-TSSOP (0.173",4.40mm Width) | 20-TSSOP | LVCMOS,LVTTL | 1 | 0.08611111111111112 | No/Yes | 1GHz | Fanout Buffer (Distribution),Multiplexer |