Scopri i prodotti 6
immagine Numero di parte fabbricante quantità Periodo di consegna Prezzo unitario acquistare descrizione Packaging Operating Temperature Package / Case Supplier Device Package
8T33FS6111NLGI8
IDT,Integrated Device Technology Inc
inchiesta
-
-
MOQ: 0  MPQ: 1
IC FANOUT BUFFER 32VFQFN
Tape & Reel (TR) -40°C ~ 85°C 32-VFQFN Exposed Pad 32-VFQFPN (5x5)
8T33FS6111NLGI
IDT,Integrated Device Technology Inc
inchiesta
-
-
MOQ: 0  MPQ: 1
IC FANOUT BUFFER 32VFQFN
- -40°C ~ 85°C 32-VFQFN Exposed Pad 32-VFQFPN (5x5)
8T33FS6111NLGI/W
IDT,Integrated Device Technology Inc
inchiesta
-
-
MOQ: 0  MPQ: 1
IC FANOUT BUFFER 32VFQFN
- -40°C ~ 85°C 32-VFQFN Exposed Pad 32-VFQFPN (5x5)
8T33FS6111DXGI
IDT,Integrated Device Technology Inc
inchiesta
-
-
MOQ: 1  MPQ: 1
NETWORK TIMING
- -40°C ~ 85°C (TA) 32-TQFP Exposed Pad 32-TQFP (7x7)
8T33FS6111PFGI8
IDT,Integrated Device Technology Inc
inchiesta
-
-
MOQ: 0  MPQ: 1
IC FANOUT BUFFER 32LQFP
Tape & Reel (TR) -40°C ~ 85°C 32-LQFP 32-TQFP (7x7)
8T33FS6111PFGI
IDT,Integrated Device Technology Inc
inchiesta
-
-
MOQ: 0  MPQ: 1
IC FANOUT BUFFER 32LQFP
- -40°C ~ 85°C 32-LQFP 32-TQFP (7x7)