- Voltage - Supply:
-
- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Input:
-
- Ratio - Input:Output:
-
- Condizioni selezionate:
Scopri i prodotti 25
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Number of Circuits | Ratio - Input:Output | Type | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Input | Number of Circuits | Ratio - Input:Output | Type | ||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 100 MPQ: 1
|
IC CLK MULTIPLX 2:1/1:2 16VFQFN
|
Tube | - | 2.375 V ~ 3.465 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) | CML,LVDS,LVPECL | 2 | 2:1,1:2 | Multiplexer | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC CLK MULTIPLX 2:1/1:2 16VFQFN
|
Tape & Reel (TR) | - | 2.375 V ~ 3.465 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) | CML,LVDS,LVPECL | 2 | 2:1,1:2 | Multiplexer | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 100 MPQ: 1
|
IC CLK BUFFER 1:2 2.5GHZ 16VFQFN
|
Tube | - | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) | CML,LVDS,LVPECL | 1 | 0.04305555555555556 | Fanout Buffer (Distribution),Divider,Multiplexer | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC CLK BUFFER 1:2 2.5GHZ 16VFQFN
|
Tape & Reel (TR) | - | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-VFQFN (3x3) | CML,LVDS,LVPECL | 1 | 0.04305555555555556 | Fanout Buffer (Distribution),Divider,Multiplexer | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 96 MPQ: 1
|
IC CLK BUFFER 2:4 2.5GHZ 16TSSOP
|
Tube | 100ES | 2.375 V ~ 3.8 V | -40°C ~ 85°C | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | HSTL,LVPECL | 1 | 0.08611111111111112 | Fanout Buffer (Distribution),Multiplexer | ||||
Microchip Technology |
518
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:2 2.5GHZ 16MLF
|
Tube | Precision Edge | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad,16-MLF? | 16-MLF? (3x3) | CML,HSTL,LVDS,LVPECL | 1 | 0.04305555555555556 | Fanout Buffer (Distribution),Divider | ||||
ON Semiconductor |
320
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:1 2.5GHZ 32QFN
|
Tube | ECLinPS MAX | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-QFN (5x5) | CML,LVDS,LVPECL | 2 | 0.08402777777777777 | Fanout Buffer (Distribution),Multiplexer,Data | ||||
IDT,Integrated Device Technology Inc |
484
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 2:1 2.5GHZ
|
Tube | - | 2.375 V ~ 3.465 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) | CML,LVDS,LVPECL | 1 | 0.08402777777777777 | Fanout Buffer (Distribution),Multiplexer | ||||
Microchip Technology |
111
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK MULTIPLX 2:1 2.5GHZ 32MLF
|
Tray | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad,32-MLF? | 32-MLF? (5x5) | CML,LVDS,PECL | 2 | 0.08402777777777777 | Multiplexer | ||||
Microchip Technology |
253
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:3 2.5GHZ 16MLF
|
Tube | Precision Edge | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad,16-MLF? | 16-MLF? (3x3) | CML,HSTL,LVDS,LVPECL | 1 | 0.04375 | Fanout Buffer (Distribution),Divider | ||||
IDT,Integrated Device Technology Inc |
200
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MUX 2:1 DIFF-LVPECL 16TSSOP
|
Tube | - | 2.375 V ~ 3.465 V | -40°C ~ 85°C | 16-TSSOP (0.173",4.40mm Width) | 16-TSSOP | CML,LVDS,LVPECL | 1 | 0.08402777777777777 | Fanout Buffer (Distribution),Multiplexer | ||||
Microchip Technology |
146
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:2 2.5GHZ 16QFN
|
Tube | Precision Edge | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-QFN (3x3) | CML,HSTL,LVCMOS,LVDS,LVTTL,PECL | 1 | 0.04305555555555556 | Fanout Buffer (Distribution),Divider,Multiplexer | ||||
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC CLK BUFFER 1:3 2.5GHZ 16MLF
|
Tape & Reel (TR) | Precision Edge | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad,16-MLF? | 16-MLF? (3x3) | CML,HSTL,LVDS,LVPECL | 1 | 0.04375 | Fanout Buffer (Distribution),Divider | ||||
Microchip Technology |
961
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:3 2.5GHZ 16MLF
|
Cut Tape (CT) | Precision Edge | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad,16-MLF? | 16-MLF? (3x3) | CML,HSTL,LVDS,LVPECL | 1 | 0.04375 | Fanout Buffer (Distribution),Divider | ||||
Microchip Technology |
961
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC CLK BUFFER 1:3 2.5GHZ 16MLF
|
- | Precision Edge | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad,16-MLF? | 16-MLF? (3x3) | CML,HSTL,LVDS,LVPECL | 1 | 0.04375 | Fanout Buffer (Distribution),Divider | ||||
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC CLK MULTIPLX 2:1 2.5GHZ 32MLF
|
Tape & Reel (TR) | Precision Edge | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad,32-MLF? | 32-MLF? (5x5) | CML,LVDS,PECL | 2 | 0.08402777777777777 | Multiplexer | ||||
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC CLK BUFFER 1:2 2.5GHZ 16QFN
|
Tape & Reel (TR) | Precision Edge | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad | 16-QFN (3x3) | CML,HSTL,LVCMOS,LVDS,LVTTL,PECL | 1 | 0.04305555555555556 | Fanout Buffer (Distribution),Divider,Multiplexer | ||||
ON Semiconductor |
inchiesta
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC CLK BUFFER 2:1 2.5GHZ 32QFN
|
Tape & Reel (TR) | ECLinPS MAX | 2.375 V ~ 3.6 V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-QFN (5x5) | CML,LVDS,LVPECL | 2 | 0.08402777777777777 | Fanout Buffer (Distribution),Multiplexer,Data | ||||
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC CLK BUFFER 1:2 2.5GHZ 16MLF
|
Tape & Reel (TR) | Precision Edge | 2.375 V ~ 3.63 V | -40°C ~ 85°C | 16-VFQFN Exposed Pad,16-MLF? | 16-MLF? (3x3) | CML,HSTL,LVDS,LVPECL | 1 | 0.04305555555555556 | Fanout Buffer (Distribution),Divider | ||||
IDT,Integrated Device Technology Inc |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NETWORK TIMING
|
- | - | 2.375 V ~ 3.465 V | -40°C ~ 85°C (TA) | 16-VFQFN Exposed Pad | 16-VFQFPN (3x3) | CML,LVDS,LVPECL | 2 | 0.1270833333333333 | Multiplexer |