Scopri i prodotti 10
immagine Numero di parte fabbricante quantità Periodo di consegna Prezzo unitario acquistare descrizione Packaging Operating Temperature Package / Case Supplier Device Package Mounting Type
DS17885S-3+
Maxim Integrated
180
3 giorni
-
MOQ: 1  MPQ: 1
IC RTC CLK/CALENDAR PAR 24-SOIC
Tube 0°C ~ 70°C 24-SOIC (0.295",7.50mm Width) 24-SOIC Surface Mount
DS17887-3IND+
Maxim Integrated
19
3 giorni
-
MOQ: 1  MPQ: 1
IC RTC CLK/CALENDAR PAR 24-EDIP
Tube -40°C ~ 85°C 24-DIP Module (0.600",15.24mm) 24-EDIP Through Hole
DS17887-3+
Maxim Integrated
inchiesta
-
-
MOQ: 1  MPQ: 1
IC RTC CLK/CALENDAR PAR 24-EDIP
Tube 0°C ~ 70°C 24-DIP Module (0.600",15.24mm) 24-EDIP Through Hole
DS17885SN-3+
Maxim Integrated
inchiesta
-
-
MOQ: 30  MPQ: 1
IC RTC CLK/CALENDAR PAR 24-SOIC
Tube -40°C ~ 85°C 24-SOIC (0.295",7.50mm Width) 24-SOIC Surface Mount
DS17885-3
Maxim Integrated
inchiesta
-
-
MOQ: 512  MPQ: 1
IC RTC CLK/CALENDAR PAR 24-DIP
Tube 0°C ~ 70°C 24-DIP (0.600",15.24mm) 24-PDIP Through Hole
DS17887-3
Maxim Integrated
inchiesta
-
-
MOQ: 42  MPQ: 1
IC RTC CLK/CALENDAR PAR 24-EDIP
Tube 0°C ~ 70°C 24-DIP Module (0.600",15.24mm) 24-EDIP Through Hole
DS17887-3-IND
Maxim Integrated
inchiesta
-
-
MOQ: 28  MPQ: 1
IC RTC CLK/CALENDAR PAR 24-EDIP
Tube -40°C ~ 85°C 24-DIP Module (0.600",15.24mm) 24-EDIP Through Hole
DS17885E-3+
Maxim Integrated
inchiesta
-
-
MOQ: 40  MPQ: 1
IC RTC CLK/CALENDAR PAR 28-TSOP
Tray 0°C ~ 70°C 28-TSSOP (0.465",11.80mm Width) 28-TSOP Surface Mount
DS17885-3+
Maxim Integrated
inchiesta
-
-
MOQ: 0  MPQ: 1
IC RTC CLK/CALENDAR PAR 24-DIP
Tube 0°C ~ 70°C 24-DIP (0.600",15.24mm) 24-PDIP Through Hole
DS17885EN-3+
Maxim Integrated
inchiesta
-
-
MOQ: 0  MPQ: 1
IC RTC CLK/CALENDAR PAR 28-TSOP
Tube -40°C ~ 85°C 28-TSSOP (0.465",11.80mm Width) 28-TSOP Surface Mount