- Interface：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Non-Volatile Memory：
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- On-Chip RAM：
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- Condizioni selezionate:
Scopri i prodotti 31
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Interface | Operating Temperature | Package / Case | Supplier Device Package | Type | Non-Volatile Memory | On-Chip RAM | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Interface | Operating Temperature | Package / Case | Supplier Device Package | Type | Non-Volatile Memory | On-Chip RAM | |
|
|
|
Analog Devices Inc. |
108
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 233MHZ 208-LQFP
|
DAI，DPI | 0°C ~ 70°C (TA) | 208-LQFP Exposed Pad | 208-LQFP-EP (28x28) | Floating Point | ROM (768 kB) | 256kB | ||
|
|
|
Analog Devices Inc. |
469
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 333MHZ 136CSBGA
|
DAI，SPI | 0°C ~ 70°C (TA) | 136-LFBGA，CSPBGA | 136-CSPBGA (12x12) | Floating Point | ROM (512 kB) | 384kB | ||
|
|
|
Analog Devices Inc. |
236
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 333MHZ EPAD 144LQFP
|
DAI，SPI | 0°C ~ 70°C (TA) | 144-LQFP Exposed Pad | 144-LQFP-EP (20x20) | Floating Point | ROM (512 kB) | 384kB | ||
|
|
|
Analog Devices Inc. |
2,528
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 333MHZ EPAD 144LQFP
|
DAI，SPI | 0°C ~ 70°C (TA) | 144-LQFP Exposed Pad | 144-LQFP-EP (20x20) | Floating Point | ROM (512 kB) | 384kB | ||
|
|
|
Analog Devices Inc. |
25
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 333MHZ EPAD 144LQFP
|
DAI，SPI | -40°C ~ 85°C (TA) | 144-LQFP Exposed Pad | 144-LQFP-EP (20x20) | Floating Point | ROM (512 kB) | 384kB | ||
|
|
|
Analog Devices Inc. |
57
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 333MHZ 136CSBGA
|
DAI，SPI | -40°C ~ 85°C (TA) | 136-LFBGA，CSPBGA | 136-CSPBGA (12x12) | Floating Point | ROM (512 kB) | 384kB | ||
|
|
|
Analog Devices Inc. |
16
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 333MHZ 136CSBGA
|
DAI，SPI | 0°C ~ 70°C (TA) | 136-LFBGA，CSPBGA | 136-CSPBGA (12x12) | Floating Point | ROM (512 kB) | 384kB | ||
|
|
|
Analog Devices Inc. |
11
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 333MHZ 256-BGA
|
DAI，DPI | -40°C ~ 85°C (TA) | 256-LBGA Exposed Pad | 256-BGA (27x27) | Floating Point | ROM (768 kB) | 256kB | ||
|
|
|
Analog Devices Inc. |
17
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 333MHZ EPAD 144LQFP
|
DAI，SPI | -40°C ~ 85°C (TA) | 144-LQFP Exposed Pad | 144-LQFP-EP (20x20) | Floating Point | ROM (512 kB) | 384kB | ||
|
|
|
Analog Devices Inc. |
6
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 333MHZ 136CSBGA
|
DAI，SPI | -40°C ~ 85°C (TA) | 136-LFBGA，CSPBGA | 136-CSPBGA (12x12) | Floating Point | ROM (512 kB) | 384kB | ||
|
|
|
Analog Devices Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 333MHZ 256-BGA
|
DAI，DPI | 0°C ~ 70°C (TA) | 256-LBGA Exposed Pad | 256-BGA (27x27) | Floating Point | ROM (768 kB) | 256kB | ||
|
|
|
Analog Devices Inc. |
108
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 233MHZ 208-LQFP
|
DAI，DPI | 0°C ~ 70°C (TA) | 208-LQFP Exposed Pad | 208-LQFP-EP (28x28) | Floating Point | ROM (768 kB) | 256kB | ||
|
|
|
Analog Devices Inc. |
469
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 333MHZ 136CSBGA
|
DAI，SPI | 0°C ~ 70°C (TA) | 136-LFBGA，CSPBGA | 136-CSPBGA (12x12) | Floating Point | ROM (512 kB) | 384kB | ||
|
|
|
Analog Devices Inc. |
236
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 333MHZ EPAD 144LQFP
|
DAI，SPI | 0°C ~ 70°C (TA) | 144-LQFP Exposed Pad | 144-LQFP-EP (20x20) | Floating Point | ROM (512 kB) | 384kB | ||
|
|
|
Analog Devices Inc. |
2,528
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 333MHZ EPAD 144LQFP
|
DAI，SPI | 0°C ~ 70°C (TA) | 144-LQFP Exposed Pad | 144-LQFP-EP (20x20) | Floating Point | ROM (512 kB) | 384kB | ||
|
|
|
Analog Devices Inc. |
25
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 333MHZ EPAD 144LQFP
|
DAI，SPI | -40°C ~ 85°C (TA) | 144-LQFP Exposed Pad | 144-LQFP-EP (20x20) | Floating Point | ROM (512 kB) | 384kB | ||
|
|
|
Analog Devices Inc. |
57
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 333MHZ 136CSBGA
|
DAI，SPI | -40°C ~ 85°C (TA) | 136-LFBGA，CSPBGA | 136-CSPBGA (12x12) | Floating Point | ROM (512 kB) | 384kB | ||
|
|
|
Analog Devices Inc. |
16
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 333MHZ 136CSBGA
|
DAI，SPI | 0°C ~ 70°C (TA) | 136-LFBGA，CSPBGA | 136-CSPBGA (12x12) | Floating Point | ROM (512 kB) | 384kB | ||
|
|
|
Analog Devices Inc. |
11
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 333MHZ 256-BGA
|
DAI，DPI | -40°C ~ 85°C (TA) | 256-LBGA Exposed Pad | 256-BGA (27x27) | Floating Point | ROM (768 kB) | 256kB | ||
|
|
|
Analog Devices Inc. |
17
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC DSP 32BIT 333MHZ EPAD 144LQFP
|
DAI，SPI | -40°C ~ 85°C (TA) | 144-LQFP Exposed Pad | 144-LQFP-EP (20x20) | Floating Point | ROM (512 kB) | 384kB |
