Scopri i prodotti 12
immagine Numero di parte fabbricante quantità Periodo di consegna Prezzo unitario acquistare descrizione Operating Temperature Package / Case Supplier Device Package Number of I/O
XC3S4000-4FGG676C
Xilinx Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC FPGA 489 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BGA 676-FBGA (27x27) 489
XC3S4000-5FGG676C
Xilinx Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC FPGA 489 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BGA 676-FBGA (27x27) 489
XC3S4000-4FGG676I
Xilinx Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC FPGA 489 I/O 676FBGA
-40°C ~ 100°C (TJ) 676-BGA 676-FBGA (27x27) 489
XC3S4000-4FGG900C
Xilinx Inc.
inchiesta
-
-
MOQ: 27  MPQ: 1
IC FPGA 633 I/O 900FBGA
0°C ~ 85°C (TJ) 900-BBGA 900-FBGA (31x31) 633
XC3S4000-5FGG900C
Xilinx Inc.
inchiesta
-
-
MOQ: 27  MPQ: 1
IC FPGA 633 I/O 900FBGA
0°C ~ 85°C (TJ) 900-BBGA 900-FBGA (31x31) 633
XC3S4000-4FGG900I
Xilinx Inc.
inchiesta
-
-
MOQ: 27  MPQ: 1
IC FPGA 633 I/O 900FBGA
-40°C ~ 100°C (TJ) 900-BBGA 900-FBGA (31x31) 633
XC3S4000-4FG676C
Xilinx Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC FPGA 489 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 489
XC3S4000-4FG676I
Xilinx Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC FPGA 489 I/O 676FBGA
-40°C ~ 100°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 489
XC3S4000-5FG676C
Xilinx Inc.
inchiesta
-
-
MOQ: 40  MPQ: 1
IC FPGA 489 I/O 676FBGA
0°C ~ 85°C (TJ) 676-BBGA,FCBGA 676-FCBGA (27x27) 489
XC3S4000-4FG900C
Xilinx Inc.
inchiesta
-
-
MOQ: 27  MPQ: 1
IC FPGA 633 I/O 900FBGA
0°C ~ 85°C (TJ) 900-BBGA 900-FBGA (31x31) 633
XC3S4000-4FG900I
Xilinx Inc.
inchiesta
-
-
MOQ: 27  MPQ: 1
IC FPGA 633 I/O 900FBGA
-40°C ~ 100°C (TJ) 900-BBGA 900-FBGA (31x31) 633
XC3S4000-5FG900C
Xilinx Inc.
inchiesta
-
-
MOQ: 27  MPQ: 1
IC FPGA 633 I/O 900FBGA
0°C ~ 85°C (TJ) 900-BBGA 900-FBGA (31x31) 633