Supplier Device Package:
Number of I/O:
Scopri i prodotti 8
immagine Numero di parte fabbricante quantità Periodo di consegna Prezzo unitario acquistare descrizione Operating Temperature Package / Case Supplier Device Package Number of I/O
EP2AGZ225FF35C4N
Intel
inchiesta
-
-
MOQ: 24  MPQ: 1
IC FPGA 554 I/O 1152FBGA
0°C ~ 85°C (TJ) 1152-BBGA,FCBGA 1152-FBGA (35x35) 554
EP2AGZ225HF40C4N
Intel
inchiesta
-
-
MOQ: 21  MPQ: 1
IC FPGA 734 I/O 1517FBGA
0°C ~ 85°C (TJ) 1517-BBGA,FCBGA 1517-FBGA (40x40) 734
EP2AGZ225FF35C3N
Intel
inchiesta
-
-
MOQ: 24  MPQ: 1
IC FPGA 554 I/O 1152FBGA
0°C ~ 85°C (TJ) 1152-BBGA,FCBGA 1152-FBGA (35x35) 554
EP2AGZ225FF35I4N
Intel
inchiesta
-
-
MOQ: 24  MPQ: 1
IC FPGA 554 I/O 1152FBGA
-40°C ~ 100°C (TJ) 1152-BBGA,FCBGA 1152-FBGA (35x35) 554
EP2AGZ225HF40C3N
Intel
inchiesta
-
-
MOQ: 21  MPQ: 1
IC FPGA 734 I/O 1517FBGA
0°C ~ 85°C (TJ) 1517-BBGA,FCBGA 1517-FBGA (40x40) 734
EP2AGZ225HF40I4N
Intel
inchiesta
-
-
MOQ: 21  MPQ: 1
IC FPGA 734 I/O 1517FBGA
-40°C ~ 100°C (TJ) 1517-BBGA,FCBGA 1517-FBGA (40x40) 734
EP2AGZ225FF35I3N
Intel
inchiesta
-
-
MOQ: 24  MPQ: 1
IC FPGA 554 I/O 1152FBGA
-40°C ~ 100°C (TJ) 1152-BBGA,FCBGA 1152-FBGA (35x35) 554
EP2AGZ225HF40I3N
Intel
inchiesta
-
-
MOQ: 21  MPQ: 1
IC FPGA 734 I/O 1517FBGA
-40°C ~ 100°C (TJ) 1517-BBGA,FCBGA 1517-FBGA (40x40) 734