- Operating Temperature：
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- Condizioni selezionate:
Scopri i prodotti 10
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Size / Dimension | Connector Type | Core Processor | Module/Board Type | Speed | Flash Size | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Size / Dimension | Connector Type | Core Processor | Module/Board Type | Speed | Flash Size | |
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Trenz Electronic GmbH |
3
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SOM USCALE+ XCZU2EG-1S 2GB DDR4
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TE0803 | 0°C ~ 85°C | 2.99" x 2.05" (76mm x 52mm) | B2B | Zynq UltraScale+ XCZU2EG-1SFVC784E | MPU Core | - | 128MB | ||
|
|
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Trenz Electronic GmbH |
4
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SOM USCALE+ XCZU3CG-1S 2GB DDR4
|
TE0803 | 0°C ~ 85°C | 2.99" x 2.05" (76mm x 52mm) | B2B | Zynq UltraScale+ XCZU3CG-1SFVC784E | MPU Core | - | 128MB | ||
|
|
|
Trenz Electronic GmbH |
3
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SOM USCALE+ XCZU15EG-1F 4GB DDR4
|
TE0808 | 0°C ~ 85°C | 2.05" x 2.99" (52mm x 76mm) | B2B | Zynq UltraScale+ XCZU15EG-1FFVC900E | MPU Core | - | 128MB | ||
|
|
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Trenz Electronic GmbH |
1
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SOM USCALE XCKU035-2S 2GB DDR4
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TE0841 | -40°C ~ 85°C | 1.97" x 1.57" (50mm x 40mm) | B2B | Kintex UltraScale KU035 | FPGA | - | 64MB | ||
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|
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Trenz Electronic GmbH |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
SOM USCALE+ XCZU2CG-1S 1GB DDR4
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TE0820 | 0°C ~ 85°C | 1.97" x 1.57" (50mm x 40mm) | B2B | Zynq UltraScale+ XCZU2CG-1SFVC784E | MPU Core | - | 128MB | ||
|
|
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Trenz Electronic GmbH |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOM USCALE+ XCZU2EG-1S 1GB DDR4
|
TE0820 | 0°C ~ 85°C | 1.97" x 1.57" (50mm x 40mm) | B2B | Zynq UltraScale+ XCZU2CG-1SFVC784E | MPU Core | - | 128MB | ||
|
|
|
Trenz Electronic GmbH |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOM USCALE+ XCZU3CG-1S 1GB DDR4
|
TE0820 | 0°C ~ 85°C | 1.97" x 1.57" (50mm x 40mm) | B2B | Zynq UltraScale+ XCZU2CG-1SFVC784E | MPU Core | - | 128MB | ||
|
|
|
Trenz Electronic GmbH |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
SOM USCALE+ XCZU4CG-1S 2GB DDR4
|
TE0803 | 0°C ~ 85°C | 2.99" x 2.05" (76mm x 52mm) | B2B | Zynq UltraScale+ XCZU4CG-1SFVC784E | MPU Core | - | 128MB | ||
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|
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DAVE Embedded Systems |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
SYSTEM ON MODULE I.MX6 2GB DDR3
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AXEL LITE | -40°C ~ 85°C | - | SO-DIMM-204 | ARM® Cortex®-A9，i.MX6 Quad | MPU Core | 1GHz | 512MB (NAND)，32MB (NOR) | ||
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|
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DAVE Embedded Systems |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
SYSTEM ON MODULE I.MX6 2GB DDR3
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AXEL ULTRA | -40°C ~ 85°C | - | 3 x 140 Pins 0.6mm Pitch | ARM® Cortex®-A9，i.MX6 Dual | MPU Core | 1GHz | 512MB (NAND)，32MB (NOR) |
