- Packaging：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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Scopri i prodotti 18
 |
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Operating Temperature | Package / Case | Supplier Device Package | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Operating Temperature | Package / Case | Supplier Device Package | |
|
|
|
NXP USA Inc. |
3,000
|
3 giorni |
-
|
MOQ: 3000 MPQ: 1
|
SECURITY IC STD TEMP WLCSP
|
Tape & Reel (TR) | -25°C ~ 85°C (TA) | 12-UFBGA，WLCSP | 12-WLCSP (2.06x2.02) | ||
|
|
|
NXP USA Inc. |
3,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC STD TEMP WLCSP
|
Cut Tape (CT) | -25°C ~ 85°C (TA) | 12-UFBGA，WLCSP | 12-WLCSP (2.06x2.02) | ||
|
|
|
NXP USA Inc. |
3,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC STD TEMP WLCSP
|
- | -25°C ~ 85°C (TA) | 12-UFBGA，WLCSP | 12-WLCSP (2.06x2.02) | ||
|
|
|
NXP USA Inc. |
6,000
|
3 giorni |
-
|
MOQ: 6000 MPQ: 1
|
SECURITY IC STD TEMP HVSON8
|
Tape & Reel (TR) | -25°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | ||
|
|
|
NXP USA Inc. |
6,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC STD TEMP HVSON8
|
Cut Tape (CT) | -25°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | ||
|
|
|
NXP USA Inc. |
6,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC STD TEMP HVSON8
|
- | -25°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | ||
|
|
|
NXP USA Inc. |
3,000
|
3 giorni |
-
|
MOQ: 3000 MPQ: 1
|
SECURITY IC EXT TEMP WLCSP
|
Tape & Reel (TR) | -40°C ~ 90°C (TA) | 12-UFBGA，WLCSP | 12-WLCSP (2.06x2.02) | ||
|
|
|
NXP USA Inc. |
3,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC EXT TEMP WLCSP
|
Cut Tape (CT) | -40°C ~ 90°C (TA) | 12-UFBGA，WLCSP | 12-WLCSP (2.06x2.02) | ||
|
|
|
NXP USA Inc. |
3,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC EXT TEMP WLCSP
|
- | -40°C ~ 90°C (TA) | 12-UFBGA，WLCSP | 12-WLCSP (2.06x2.02) | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 6000 MPQ: 1
|
SECURE AUTHENTICATION
|
Tape & Reel (TR) | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | ||
|
|
|
NXP USA Inc. |
5,732
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SECURE AUTHENTICATION
|
Cut Tape (CT) | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | ||
|
|
|
NXP USA Inc. |
5,732
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SECURE AUTHENTICATION
|
- | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 6000 MPQ: 1
|
SECURITY IC EXT TEMP HVSON8
|
Tape & Reel (TR) | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | ||
|
|
|
NXP USA Inc. |
5,999
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC EXT TEMP HVSON8
|
Cut Tape (CT) | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | ||
|
|
|
NXP USA Inc. |
5,999
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC EXT TEMP HVSON8
|
- | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 6000 MPQ: 1
|
SECURE AUTHENTICATION
|
Tape & Reel (TR) | -25°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | ||
|
|
|
NXP USA Inc. |
9
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SECURE AUTHENTICATION
|
Cut Tape (CT) | -25°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | ||
|
|
|
NXP USA Inc. |
9
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SECURE AUTHENTICATION
|
- | -25°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) |
