- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Core Processor:
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- Voltage - I/O:
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- Speed:
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- Co-Processors/DSP:
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- RAM Controllers:
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- Display & Interface Controllers:
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- SATA:
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Scopri i prodotti 20
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | USB | Security Features | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | SATA | USB | Security Features | ||
Microchip Technology |
1,889
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324LFBGA
|
SAMA5D3 | -40°C ~ 85°C (TA) | 324-LFBGA | 324-LFBGA (15x15) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 536MHz | - | LPDDR,LPDDR2,DDR2 | No | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
Microchip Technology |
1,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 160KB ROM 324TFBGA
|
SAMA5D3 | -40°C ~ 85°C (TA) | 324-TFBGA | 324-TFBGA (12x12) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 536MHz | - | LPDDR,LPDDR2,DDR2 | No | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
Texas Instruments |
1,159
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU OMAP-L1X 375MHZ 361NFBGA
|
OMAP-L1x | -40°C ~ 105°C (TJ) | 361-LFBGA | 361-NFBGA (16x16) | ARM926EJ-S | 1.8V,3.3V | 375MHz | Signal Processing; C674x,System Control; CP15 | LPDDR,DDR2 | No | LCD | SATA 3Gbps (1) | USB 1.1 + PHY (1),USB 2.0 + PHY (1) | Boot Security,Cryptography | ||||
Microchip Technology |
1,500
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 196TFBGA
|
SAMA5D2 | -40°C ~ 105°C (TA) | 196-TFBGA,CSBGA | 196-TFBGA (11x11) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1,LPDDR2,LPDDR3,DDR2,DDR3,DDR3L,QSPI | Yes | Keyboard,LCD,Touchscreen | - | USB 2.0 + HSIC | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
Microchip Technology |
2,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 256TFBGA
|
SAMA5D2 | -40°C ~ 85°C (TA) | 256-TFBGA | 256-TFBGA (8x8) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1,LPDDR2,LPDDR3,DDR2,DDR3,DDR3L,QSPI | Yes | Keyboard,LCD,Touchscreen | - | USB 2.0 + HSIC | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
Microchip Technology |
1,167
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 196TFBGA
|
SAMA5D2 | -40°C ~ 85°C (TA) | 196-TFBGA,CSBGA | 196-TFBGA (11x11) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1,LPDDR2,LPDDR3,DDR2,DDR3,DDR3L,QSPI | Yes | Keyboard,LCD,Touchscreen | - | USB 2.0 + HSIC | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
Microchip Technology |
1,461
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 196TFBGA
|
SAMA5D2 | -40°C ~ 85°C (TA) | 196-TFBGA,CSBGA | 196-TFBGA (11x11) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1,LPDDR2,LPDDR3,DDR2,DDR3,DDR3L,QSPI | Yes | Keyboard,LCD,Touchscreen | - | USB 2.0 + HSIC | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
Microchip Technology |
636
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
SAMA5D2 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1,LPDDR2,LPDDR3,DDR2,DDR3,DDR3L,QSPI | Yes | Keyboard,LCD,Touchscreen | - | USB 2.0 + HSIC | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
Microchip Technology |
940
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
SAMA5D2 | -40°C ~ 105°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1,LPDDR2,LPDDR3,DDR2,DDR3,DDR3L,QSPI | Yes | Keyboard,LCD,Touchscreen | - | USB 2.0 + HSIC | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
Microchip Technology |
713
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
SAMA5D2 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1,LPDDR2,LPDDR3,DDR2,DDR3,DDR3L,QSPI | Yes | Keyboard,LCD,Touchscreen | - | USB 2.0 + HSIC | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
Microchip Technology |
930
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
SAMA5D2 | -40°C ~ 105°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1,LPDDR2,LPDDR3,DDR2,DDR3,DDR3L,QSPI | Yes | Keyboard,LCD,Touchscreen | - | USB 2.0 + HSIC | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
Microchip Technology |
990
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
BGA GREEN,IND TEMP
|
SAMA5D4 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 600MHz | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
Microchip Technology |
960
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
BGA GREEN,IND TEMP
|
SAMA5D4 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 600MHz | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
Microchip Technology |
680
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
BGA GREEN,IND TEMP
|
SAMA5D4 | -40°C ~ 85°C (TA) | 361-TFBGA | 361-TFBGA (16x16) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 600MHz | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
Microchip Technology |
989
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
BGA GREEN,IND TEMP
|
SAMA5D4 | -40°C ~ 85°C (TA) | 361-TFBGA | 361-TFBGA (16x16) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 600MHz | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
Microchip Technology |
1,475
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
BGA GREEN,IND TEMP,MRLC,128MBIT
|
SAMA5D2 | -40°C ~ 85°C (TA) | 196-TFBGA,CSBGA | 196-TFBGA (11x11) | ARM® Cortex®-A5 | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1,LPDDR2,LPDDR3,DDR2,DDR3,DDR3L,QSPI | Yes | Keyboard,LCD,Touchscreen | - | USB 2.0 + HSIC | ARM TZ,Boot Security,Cryptography,RTIC,Secure Fusebox,Secure JTAG,Secure Memory,Secure RTC | ||||
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB ROM 289LFBGA
|
SAMA5D4 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 600MHz | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB ROM 361TFBGA
|
SAMA5D4 | -40°C ~ 85°C (TA) | 361-TFBGA | 361-TFBGA (16x16) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 600MHz | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB ROM 289LFBGA
|
SAMA5D4 | -40°C ~ 85°C (TA) | 289-LFBGA | 289-LFBGA (14x14) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 600MHz | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG | ||||
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT 128KB ROM 361TFBGA
|
SAMA5D4 | -40°C ~ 85°C (TA) | 361-TFBGA | 361-TFBGA (16x16) | ARM® Cortex®-A5 | 1.2V,1.8V,3.3V | 600MHz | Multimedia; NEON® SIMD | LPDDR,LPDDR2,DDR2 | Yes | LCD,Touchscreen | - | USB 2.0 (3) | AES,SHA,TDES,TRNG |