- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Core Processor：
-
- Co-Processors/DSP：
-
- RAM Controllers：
-
- Ethernet：
-
- USB：
-
- Security Features：
-
- Condizioni selezionate:
Scopri i prodotti 52
 |
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Co-Processors/DSP | RAM Controllers | Ethernet | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Co-Processors/DSP | RAM Controllers | Ethernet | USB | Security Features | |
|
|
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NXP USA Inc. |
28
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 300MHZ 352TBGA
|
0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | - | SDRAM | - | - | - | ||
|
|
|
NXP USA Inc. |
16
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
40
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 300MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
200
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 300MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 300MHZ 516BGA
|
-40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 300MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | Communications; RISC CPM，Security; SEC | DRAM，SDRAM | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC MPU MPC82XX 300MHZ 352TBGA
|
0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | - | SDRAM | - | - | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC MPU MPC82XX 300MHZ 352TBGA
|
-40°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | - | SDRAM | - | - | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC MPU MPC82XX 300MHZ 352TBGA
|
-40°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | - | SDRAM | - | - | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 21 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | - | - |
