- Operating Temperature：
-
- Package / Case：
-
- Supplier Device Package：
-
- Core Processor：
-
- Speed：
-
- Co-Processors/DSP：
-
- Ethernet：
-
- USB：
-
- Security Features：
-
- Condizioni selezionate:
Scopri i prodotti 234
 |
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Co-Processors/DSP | Ethernet | USB | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Co-Processors/DSP | Ethernet | USB | Security Features | |
|
|
|
NXP USA Inc. |
734
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
-40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | Communications; RISC CPM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
440
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
-40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | Communications; RISC CPM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
305
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 450MHz | Communications; RISC CPM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
368
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
-40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 450MHz | Communications; RISC CPM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
98
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
-40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 450MHz | Communications; RISC CPM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
40
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | Communications; RISC CPM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
79
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 480TBGA
|
-40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 333MHz | Communications; RISC CPM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
122
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
-40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | Communications; RISC CPM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
102
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
-40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | Communications; RISC CPM，Security; SEC | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
101
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
-40°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | Communications; RISC CPM，Security; SEC | 10/100 Mbps (2) | USB 2.0 (1) | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
40
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 266MHz | Communications; RISC CPM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
29
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 333MHz | Communications; RISC CPM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
26
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 480TBGA
|
-40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 266MHz | Communications; RISC CPM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
74
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | Communications; RISC CPM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
74
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 400MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2_LE | 400MHz | Communications; RISC CPM | 10/100 Mbps (2) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
19
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 450MHz | Communications; RISC CPM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
15
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 450MHz | Communications; RISC CPM | 10/100 Mbps (3) | USB 2.0 (1) | - | ||
|
|
|
NXP USA Inc. |
16
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 300MHz | Communications; RISC CPM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
12
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 480TBGA
|
-40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 266MHz | Communications; RISC CPM | 10/100 Mbps (3) | - | - | ||
|
|
|
NXP USA Inc. |
3
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 450MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2_LE | 450MHz | Communications; RISC CPM | 10/100 Mbps (3) | USB 2.0 (1) | - |
