- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Core Processor：
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- Speed：
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- Co-Processors/DSP：
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- RAM Controllers：
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- Ethernet：
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- Condizioni selezionate:
Scopri i prodotti 163
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Co-Processors/DSP | RAM Controllers | Ethernet | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Speed | Co-Processors/DSP | RAM Controllers | Ethernet | |
|
|
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NXP USA Inc. |
75
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 352TBGA
|
-40°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 333MHz | - | SDRAM | - | ||
|
|
|
NXP USA Inc. |
184
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 200MHZ 357BGA
|
0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 200MHz | - | SDRAM | - | ||
|
|
|
NXP USA Inc. |
139
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 333MHZ 352TBGA
|
0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 333MHz | - | SDRAM | - | ||
|
|
|
NXP USA Inc. |
1,376
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 357BGA
|
0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 266MHz | - | SDRAM | - | ||
|
|
|
NXP USA Inc. |
265
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 352TBGA
|
0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 266MHz | - | SDRAM | - | ||
|
|
|
NXP USA Inc. |
45
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 350MHZ 352TBGA
|
0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 350MHz | - | SDRAM | - | ||
|
|
|
NXP USA Inc. |
26
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 480TBGA
|
-40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 266MHz | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | ||
|
|
|
NXP USA Inc. |
28
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 300MHZ 352TBGA
|
0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 300MHz | - | SDRAM | - | ||
|
|
|
NXP USA Inc. |
21
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 200MHZ 357BGA
|
0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 200MHz | - | SDRAM | - | ||
|
|
|
NXP USA Inc. |
16
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 300MHZ 480TBGA
|
0°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 300MHz | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | ||
|
|
|
NXP USA Inc. |
12
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 480TBGA
|
-40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 266MHz | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | ||
|
|
|
NXP USA Inc. |
58
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 480TBGA
|
-40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 266MHz | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | ||
|
|
|
NXP USA Inc. |
19
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU MPC82XX 266MHZ 480TBGA
|
-40°C ~ 105°C (TA) | 480-LBGA Exposed Pad | 480-TBGA (37.5x37.5) | PowerPC G2 | 266MHz | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC82XX 166MHZ 357BGA
|
0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 166MHz | - | SDRAM | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC82XX 266MHZ 357BGA
|
0°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 266MHz | - | SDRAM | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC82XX 200MHZ 357BGA
|
-40°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 200MHz | - | SDRAM | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 44 MPQ: 1
|
IC MPU MPC82XX 200MHZ 357BGA
|
-40°C ~ 105°C (TA) | 357-BBGA | 357-PBGA (25x25) | PowerPC 603e | 200MHz | - | SDRAM | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 24 MPQ: 1
|
IC MPU MPC82XX 266MHZ 352TBGA
|
0°C ~ 105°C (TA) | 352-LBGA | 352-TBGA (35x35) | PowerPC 603e | 266MHz | - | SDRAM | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 200MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2 | 200MHz | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MPU MPC82XX 200MHZ 516BGA
|
0°C ~ 105°C (TA) | 516-BBGA | 516-FPBGA (27x27) | PowerPC G2 | 200MHz | Communications; RISC CPM | DRAM，SDRAM | 10/100 Mbps (3) |
