- Packaging：
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- Series：
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- Operating Temperature：
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- Speed：
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- Number of Cores/Bus Width：
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- Condizioni selezionate:
Scopri i prodotti 89
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Operating Temperature | Speed | Number of Cores/Bus Width | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Operating Temperature | Speed | Number of Cores/Bus Width | |
|
|
|
NXP USA Inc. |
1,129
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | 0°C ~ 95°C (TJ) | 1.0GHz | 1 Core，32-Bit | ||
|
|
|
NXP USA Inc. |
230
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | 0°C ~ 95°C (TJ) | 1.0GHz | 1 Core，32-Bit | ||
|
|
|
NXP USA Inc. |
1,173
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | -20°C ~ 105°C (TJ) | 1.0GHz | 1 Core，32-Bit | ||
|
|
|
NXP USA Inc. |
1,825
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 105°C (TA) | 800MHz | 1 Core，32-Bit | ||
|
|
|
NXP USA Inc. |
446
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 125°C (TJ) | 800MHz | 1 Core，32-Bit | ||
|
|
|
NXP USA Inc. |
911
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | 0°C ~ 95°C (TJ) | 1.0GHz | 2 Core，32-Bit | ||
|
|
|
NXP USA Inc. |
292
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | -20°C ~ 105°C (TJ) | 1.0GHz | 2 Core，32-Bit | ||
|
|
|
NXP USA Inc. |
499
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 800MHZ 624MAPBGA
|
Tray | i.MX6DL | -40°C ~ 105°C (TA) | 800MHz | 2 Core，32-Bit | ||
|
|
|
NXP USA Inc. |
420
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | -40°C ~ 125°C (TJ) | 1GHz | 2 Core，32-Bit | ||
|
|
|
NXP USA Inc. |
761
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 105°C (TA) | 800MHz | 1 Core，32-Bit | ||
|
|
|
NXP USA Inc. |
653
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | -20°C ~ 105°C (TJ) | 1.0GHz | 1 Core，32-Bit | ||
|
|
|
NXP USA Inc. |
466
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | -20°C ~ 105°C (TJ) | 1.0GHz | 2 Core，32-Bit | ||
|
|
|
NXP USA Inc. |
156
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tray | i.MX6DL | 0°C ~ 95°C (TJ) | 1.0GHz | 2 Core，32-Bit | ||
|
|
|
NXP USA Inc. |
500
|
3 giorni |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tape & Reel (TR) | i.MX6DL | 0°C ~ 95°C (TJ) | 1.0GHz | 2 Core，32-Bit | ||
|
|
|
NXP USA Inc. |
500
|
3 giorni |
-
|
MOQ: 500 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Tape & Reel (TR) | i.MX6DL | 0°C ~ 95°C (TJ) | 1.0GHz | 2 Core，32-Bit | ||
|
|
|
NXP USA Inc. |
500
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
Cut Tape (CT) | i.MX6DL | 0°C ~ 95°C (TJ) | 1.0GHz | 2 Core，32-Bit | ||
|
|
|
NXP USA Inc. |
500
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6DL 1.0GHZ 624MAPBGA
|
- | i.MX6DL | 0°C ~ 95°C (TJ) | 1.0GHz | 2 Core，32-Bit | ||
|
|
|
NXP USA Inc. |
60
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 1.0GHZ 624MAPBGA
|
Tray | i.MX6S | 0°C ~ 95°C (TJ) | 1.0GHz | 1 Core，32-Bit | ||
|
|
|
NXP USA Inc. |
60
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
II.MX 6S ROM PERF ENHAN
|
Tray | i.MX6S | 0°C ~ 95°C (TJ) | 1.0GHz | 1 Core，32-Bit | ||
|
|
|
NXP USA Inc. |
60
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU I.MX6S 800MHZ 624MAPBGA
|
Tray | i.MX6S | -40°C ~ 125°C (TJ) | 800MHz | 1 Core，32-Bit |
