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- Operating Temperature：
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- Speed：
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- Co-Processors/DSP：
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- RAM Controllers：
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- Display & Interface Controllers：
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- Condizioni selezionate:
Scopri i prodotti 61
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Operating Temperature | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | USB | Security Features | |
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Operating Temperature | Voltage - I/O | Speed | Co-Processors/DSP | RAM Controllers | Display & Interface Controllers | USB | Security Features | |
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Microchip Technology |
inchiesta
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- |
-
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MOQ: 0 MPQ: 1
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IC MCU 32BIT 289LFBGA
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Tray | SAMA5D2 | -40°C ~ 105°C (TA) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
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Microchip Technology |
inchiesta
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- |
-
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MOQ: 0 MPQ: 1
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IC MCU 32BIT 289LFBGA
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Tape & Reel (TR) | SAMA5D2 | -40°C ~ 105°C (TA) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
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Microchip Technology |
inchiesta
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- |
-
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MOQ: 0 MPQ: 1
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IC MCU 32BIT 289LFBGA
|
Tray | SAMA5D2 | -40°C ~ 105°C (TA) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
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Microchip Technology |
inchiesta
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- |
-
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MOQ: 0 MPQ: 1
|
IC MCU 32BIT 289LFBGA
|
Tape & Reel (TR) | SAMA5D2 | -40°C ~ 105°C (TA) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | ||
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Microchip Technology |
587
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3 giorni |
-
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MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
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Tray | SAMA5D2 | -40°C ~ 85°C (TA) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
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Microchip Technology |
230
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
Tray | SAMA5D2 | -40°C ~ 85°C (TA) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
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Microchip Technology |
243
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
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BGA GREEN，IND TEMP,MRLC,512MBIT
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Tray | SAMA5D2 | -40°C ~ 85°C (TA) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
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Microchip Technology |
396
|
3 giorni |
-
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MOQ: 1 MPQ: 1
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IC MCU 32BIT EXT MEM 289LFBGA
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Tray | SAMA5D2 | -40°C ~ 105°C (TA) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
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Microchip Technology |
576
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3 giorni |
-
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MOQ: 1 MPQ: 1
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BGA GREEN，IND TEMP,MRLB
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Tray | SAMA5D4 | -40°C ~ 85°C (TA) | 1.2V，1.8V，3.3V | 600MHz | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | |||
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Microchip Technology |
385
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3 giorni |
-
|
MOQ: 1 MPQ: 1
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BGA GREEN，IND TEMP,MRLB
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Tray | SAMA5D4 | -40°C ~ 85°C (TA) | 1.2V，1.8V，3.3V | 600MHz | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | |||
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Microchip Technology |
253
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3 giorni |
-
|
MOQ: 1 MPQ: 1
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IC MCU 32BIT 128KB ROM 289LFBGA
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Cut Tape (CT) | SAMA5D4 | -40°C ~ 85°C (TA) | 1.2V，1.8V，3.3V | 600MHz | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | |||
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Microchip Technology |
985
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
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IC MCU 32BIT 128KB ROM 289LFBGA
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Cut Tape (CT) | SAMA5D4 | -40°C ~ 85°C (TA) | 1.2V，1.8V，3.3V | 600MHz | Multimedia; NEON® SIMD | LPDDR，LPDDR2，DDR2 | LCD，Touchscreen | USB 2.0 (3) | AES，SHA，TDES，TRNG | |||
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Microchip Technology |
inchiesta
|
- |
-
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MOQ: 1000 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
Tape & Reel (TR) | SAMA5D2 | -40°C ~ 85°C (TA) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
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Microchip Technology |
636
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
Cut Tape (CT) | SAMA5D2 | -40°C ~ 85°C (TA) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
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Microchip Technology |
636
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
- | SAMA5D2 | -40°C ~ 85°C (TA) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
|
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
Tape & Reel (TR) | SAMA5D2 | -40°C ~ 105°C (TA) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
|
Microchip Technology |
940
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
Cut Tape (CT) | SAMA5D2 | -40°C ~ 105°C (TA) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
|
Microchip Technology |
940
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
- | SAMA5D2 | -40°C ~ 105°C (TA) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
|
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 1000 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
Tape & Reel (TR) | SAMA5D2 | -40°C ~ 85°C (TA) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC | |||
|
|
Microchip Technology |
713
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT EXT MEM 289LFBGA
|
Cut Tape (CT) | SAMA5D2 | -40°C ~ 85°C (TA) | 3.3V | 500MHz | Multimedia; NEON® MPE | LPDDR1，LPDDR2，LPDDR3，DDR2，DDR3，DDR3L，QSPI | Keyboard，LCD，Touchscreen | USB 2.0 + HSIC | ARM TZ，Boot Security，Cryptography，RTIC，Secure Fusebox，Secure JTAG，Secure Memory，Secure RTC |
