- Operating Temperature:
-
- Package / Case:
-
- Supplier Device Package:
-
- Speed:
-
- Number of Cores/Bus Width:
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- Condizioni selezionate:
Scopri i prodotti 26
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Speed | Number of Cores/Bus Width | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Speed | Number of Cores/Bus Width | ||
NXP USA Inc. |
170
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 2 Core,32-Bit | ||||
NXP USA Inc. |
27
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
27
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 2 Core,32-Bit | ||||
NXP USA Inc. |
54
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 2 Core,32-Bit | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 2 Core,32-Bit | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Tray | 0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | 667MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 300 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Tray | 0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | 667MHz | 2 Core,32-Bit | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Tray | 0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | 667MHz | 2 Core,32-Bit | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 27 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 2 Core,32-Bit | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 27 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 60 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Tray | 0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | 667MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 27 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689BGA
|
Tray | 0°C ~ 125°C (TA) | 689-TePBGA II | 689-PBGA-PGE | 800MHz | 2 Core,32-Bit | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Bulk | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Bulk | 0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | 667MHz | 2 Core,32-Bit | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 800MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 120 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Tray | 0°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | 667MHz | 1 Core,32-Bit | ||||
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 667MHZ 561TEBGA1
|
Tray | -40°C ~ 125°C (TA) | 561-FBGA | 561-TEPBGA1 (23x23) | 667MHz | 1 Core,32-Bit |