- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Voltage - I/O：
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- Number of Cores/Bus Width：
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- Co-Processors/DSP：
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- Security Features：
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- Condizioni selezionate:
Scopri i prodotti 54
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Operating Temperature | Package / Case | Supplier Device Package | Voltage - I/O | Number of Cores/Bus Width | Co-Processors/DSP | Security Features | |
|
|
|
NXP USA Inc. |
189
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 2.5V，3.3V | 2 Core，32-Bit | Security; SEC 3.3 | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
102
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 1 Core，32-Bit | - | - | ||
|
|
|
NXP USA Inc. |
54
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 2.5V，3.3V | 2 Core，32-Bit | - | - | ||
|
|
|
NXP USA Inc. |
170
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 2 Core，32-Bit | Communications; QUICC Engine，Security; SEC 3.3 | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
150
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 2.5V，3.3V | 2 Core，32-Bit | Security; SEC 3.3 | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
27
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 1 Core，32-Bit | Communications; QUICC Engine，Security; SEC 3.3 | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
27
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 2 Core，32-Bit | Communications; QUICC Engine，Security; SEC 3.3 | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
31
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 1 Core，32-Bit | Security; SEC 3.3 | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
38
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 1 Core，32-Bit | - | - | ||
|
|
|
NXP USA Inc. |
58
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 2.5V，3.3V | 2 Core，32-Bit | Security; SEC 3.3 | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
52
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 1 Core，32-Bit | - | - | ||
|
|
|
NXP USA Inc. |
18
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | 2.5V，3.3V | 2 Core，32-Bit | - | - | ||
|
|
|
NXP USA Inc. |
34
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 1 Core，32-Bit | - | - | ||
|
|
|
NXP USA Inc. |
27
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 1 Core，32-Bit | Communications; QUICC Engine | - | ||
|
|
|
NXP USA Inc. |
54
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 2 Core，32-Bit | Communications; QUICC Engine，Security; SEC 3.3 | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
5
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 1 Core，32-Bit | Security; SEC 3.3 | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
3
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 1 Core，32-Bit | Security; SEC 3.3 | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | 0°C ~ 125°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 1 Core，32-Bit | Communications; QUICC Engine，Security; SEC 3.3 | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 2 Core，32-Bit | Communications; QUICC Engine，Security; SEC 3.3 | Cryptography，Random Number Generator | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MPU Q OR IQ 800MHZ 689TEBGA
|
Tray | -40°C ~ 105°C (TA) | 689-BBGA Exposed Pad | 689-TEPBGA II (31x31) | - | 2 Core，32-Bit | Communications; QUICC Engine | - |
