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- Condizioni selezionate:
Scopri i prodotti 73
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | Security Features | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Voltage - I/O | Speed | Number of Cores/Bus Width | Co-Processors/DSP | RAM Controllers | Graphics Acceleration | Display & Interface Controllers | Ethernet | Security Features | |
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NXP USA Inc. |
1,022
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
I.MXRT1020 100LQFP
|
Tray | - | 0°C ~ 95°C (TJ) | 100-LQFP | 100-LQFP (14x14) | ARM® Cortex®-M7 | 1.8V，3.3V | 500MHz | 1 Core，32-Bit | - | SDRAM | No | - | 10/100 Mbps (1) | Ciphers，eFuse，RNG，Secure RTC | ||
|
|
|
NXP USA Inc. |
1,053
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
I.MXRT1020 100LQFP
|
Tray | - | -40°C ~ 105°C (TJ) | 100-LQFP | 100-LQFP (14x14) | ARM® Cortex®-M7 | 1.8V，3.3V | 396MHz | 1 Core，32-Bit | - | SDRAM | No | - | 10/100 Mbps (1) | Ciphers，eFuse，RNG，Secure RTC | ||
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|
|
NXP USA Inc. |
128
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF5xx | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 | 3.3V | 500MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | - | ||
|
|
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NXP USA Inc. |
40
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Tray | Vybrid，VF3xx | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | 3.3V | 266MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | - | ||
|
|
|
NXP USA Inc. |
40
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Bulk | Vybrid，VF3xxR | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | 3.3V | 266MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | No | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | ARM TZ，Hashing，RNG，RTC，RTIC，Secure JTAG，SNVS，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
40
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Bulk | Vybrid，VF3xxR | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | 3.3V | 266MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | No | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | ARM TZ，Hashing，RNG，RTC，RTIC，Secure JTAG，SNVS，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
80
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Tray | Vybrid，VF3xx | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | 3.3V | 266MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | ARM TZ，CAAM，HAB，RTIC，Secure JTAG，SNVS，Tamper，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
90
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF5xx | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 | 3.3V | 500MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | ARM TZ，CAAM，HAB，RTIC，Secure JTAG，SNVS，Tamper，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
89
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF6xx | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 500MHz，167MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | - | ||
|
|
|
NXP USA Inc. |
90
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF6xx | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 400MHz，167MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | ARM TZ，CAAM，HAB，RTIC，Secure JTAG，SNVS，Tamper，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
90
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF5xxR | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 | 3.3V | 400MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | ARM TZ，Hashing，RNG，RTC，RTIC，Secure JTAG，SNVS，TZ ASC，TZ WDOG | ||
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|
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NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
I.MXRT1020 144LQFP
|
Tray | - | 0°C ~ 95°C (TJ) | 144-LQFP | 144-LQFP (20x20) | ARM® Cortex®-M7 | 1.8V，3.3V | 500MHz | 1 Core，32-Bit | - | SDRAM | No | - | 10/100 Mbps (1) | Ciphers，eFuse，RNG，Secure RTC | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
I.MXRT1020 144LQFP
|
Tray | - | -40°C ~ 105°C (TJ) | 144-LQFP | 144-LQFP (20x20) | ARM® Cortex®-M7 | 1.8V，3.3V | 396MHz | 1 Core，32-Bit | - | SDRAM | No | - | 10/100 Mbps (1) | Ciphers，eFuse，RNG，Secure RTC | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF5xx | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 | 3.3V | 400MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF6xx | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 500MHz，167MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | ARM TZ，CAAM，HAB，RTIC，Secure JTAG，SNVS，Tamper，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MCU 32BIT ROMLESS 364MAPBGA
|
Tray | Vybrid，VF5xxR | -40°C ~ 85°C (TA) | 364-LFBGA | 364-LFBGA (17x17) | ARM® Cortex®-A5 + Cortex®-M4 | 3.3V | 400MHz，133MHz | 2 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | ARM TZ，Hashing，RNG，RTC，RTIC，Secure JTAG，SNVS，TZ ASC，TZ WDOG | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 152 MPQ: 1
|
I.MX6ULL ROM PERF ENHAN
|
Tray | i.MX6 | 0°C ~ 95°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.8V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DDR3L | No | Electrophoretic，LCD | 10/100 Mbps (1) | A-HAB，ARM TZ，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 152 MPQ: 1
|
I.MX6ULL ROM PERF ENHAN
|
Tray | i.MX6 | -40°C ~ 105°C (TJ) | 289-LFBGA | 289-MAPBGA (14x14) | ARM® Cortex®-A7 | 1.8V，2.8V，3.3V | 528MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DDR3L | No | Electrophoretic，LCD | 10/100 Mbps (1) | A-HAB，ARM TZ，CSU，SJC，SNVS | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Tray | Vybrid，VF3xx | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | 3.3V | 266MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | - | ||
|
|
|
NXP USA Inc. |
inchiesta
|
- |
-
|
MOQ: 40 MPQ: 1
|
IC MCU 32BIT ROMLESS 176LQFP
|
Tray | Vybrid，VF3xx | -40°C ~ 85°C (TA) | 176-LQFP Exposed Pad | 176-LQFP-EP (24x24) | ARM® Cortex®-A5 | 3.3V | 266MHz | 1 Core，32-Bit | Multimedia; NEON® MPE | LPDDR2，DDR3，DRAM | Yes | DCU，GPU，LCD，VideoADC，VIU | 10/100 Mbps (2) | ARM TZ，CAAM，HAB，RTIC，Secure JTAG，SNVS，Tamper，TZ ASC，TZ WDOG |
