- Voltage - Supply:
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- Operating Temperature:
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- Package / Case:
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- Supplier Device Package:
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- Mounting Type:
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- Channel Type:
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- Driven Configuration:
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- Gate Type:
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- Rise / Fall Time (Typ):
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- Logic Voltage - VIL, VIH:
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- Current - Peak Output (Source, Sink):
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Scopri i prodotti 1,511
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Input Type | Channel Type | Driven Configuration | Number of Drivers | Gate Type | High Side Voltage - Max (Bootstrap) | Rise / Fall Time (Typ) | Logic Voltage - VIL, VIH | Current - Peak Output (Source, Sink) | ||
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Input Type | Channel Type | Driven Configuration | Number of Drivers | Gate Type | High Side Voltage - Max (Bootstrap) | Rise / Fall Time (Typ) | Logic Voltage - VIL, VIH | Current - Peak Output (Source, Sink) | ||
Microchip Technology |
1,200
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Surface Mount | Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
1,200
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Surface Mount | Inverting,Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
1,200
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Surface Mount | Inverting,Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
1,175
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Surface Mount | Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
2,500
|
3 giorni |
-
|
MOQ: 2500 MPQ: 1
|
LOW-SIDE MOSFET DRIVER
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Surface Mount | Inverting | Single | Low-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 4.5A,4.5A | ||||
Microchip Technology |
2,500
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
LOW-SIDE MOSFET DRIVER
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Surface Mount | Inverting | Single | Low-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 4.5A,4.5A | ||||
Microchip Technology |
2,500
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
LOW-SIDE MOSFET DRIVER
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Surface Mount | Inverting | Single | Low-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 4.5A,4.5A | ||||
Microchip Technology |
2,500
|
3 giorni |
-
|
MOQ: 2500 MPQ: 1
|
LOW-SIDE MOSFET DRIVER
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Surface Mount | Inverting,Non-Inverting | Single | Low-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 4.5A,4.5A | ||||
Microchip Technology |
2,500
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
LOW-SIDE MOSFET DRIVER
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Surface Mount | Inverting,Non-Inverting | Single | Low-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 4.5A,4.5A | ||||
Microchip Technology |
2,500
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
LOW-SIDE MOSFET DRIVER
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-TSSOP,8-MSOP (0.118",3.00mm Width) | 8-MSOP | Surface Mount | Inverting,Non-Inverting | Single | Low-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 4.5A,4.5A | ||||
Microchip Technology |
1,700
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
1,200
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
1,200
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting,Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 3A,3A | ||||
Microchip Technology |
3,300
|
3 giorni |
-
|
MOQ: 3300 MPQ: 1
|
4.5A MATCHED,HIGH -SPEED,LOW-S
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting | Single | Low-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 4.5A,4.5A | ||||
Microchip Technology |
3,300
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
4.5A MATCHED,HIGH -SPEED,LOW-S
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting | Single | Low-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 4.5A,4.5A | ||||
Microchip Technology |
3,300
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
4.5A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Inverting | Single | Low-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 4.5A,4.5A | ||||
Microchip Technology |
3,300
|
3 giorni |
-
|
MOQ: 3300 MPQ: 1
|
4.5A MATCHED,HIGH -SPEED,LOW-S
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Non-Inverting | Single | Low-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 4.5A,4.5A | ||||
Microchip Technology |
3,300
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
4.5A MATCHED,HIGH -SPEED,LOW-S
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Non-Inverting | Single | Low-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 4.5A,4.5A | ||||
Microchip Technology |
3,300
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
4.5A MATCHED,HIGH -SPEED,LOW-S
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C (TA) | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Non-Inverting | Single | Low-Side | 2 | IGBT | - | 12ns,12ns | 0.8V,2V | 4.5A,4.5A | ||||
Microchip Technology |
3,300
|
3 giorni |
-
|
MOQ: 3300 MPQ: 1
|
IC MOSFET DVR 1.5A DUAL HS 8SOIC
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | -40°C ~ 150°C (TJ) | 8-SOIC (0.154",3.90mm Width) | 8-SOIC | Surface Mount | Inverting | Independent | Low-Side | 2 | N-Channel,P-Channel MOSFET | - | 25ns,25ns | 0.8V,2.4V | 1.5A,1.5A |