- Voltage - Supply：
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- Operating Temperature：
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- Package / Case：
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- Supplier Device Package：
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- Mounting Type：
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- Channel Type：
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- Driven Configuration：
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- Gate Type：
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- Rise / Fall Time (Typ)：
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- Logic Voltage - VIL, VIH：
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- Current - Peak Output (Source, Sink)：
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- Condizioni selezionate:
Scopri i prodotti 1,511
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Input Type | Channel Type | Driven Configuration | Number of Drivers | Gate Type | High Side Voltage - Max (Bootstrap) | Rise / Fall Time (Typ) | Logic Voltage - VIL, VIH | Current - Peak Output (Source, Sink) | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Packaging | Series | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Input Type | Channel Type | Driven Configuration | Number of Drivers | Gate Type | High Side Voltage - Max (Bootstrap) | Rise / Fall Time (Typ) | Logic Voltage - VIL, VIH | Current - Peak Output (Source, Sink) | |
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Microchip Technology |
3,275
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-SOIC (0.154"，3.90mm Width) | 8-SOIC | Surface Mount | Inverting | Independent | High-Side | 2 | IGBT | - | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
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Microchip Technology |
inchiesta
|
- |
-
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MOQ: 3000 MPQ: 1
|
IC MOSFET DVR 1.5A SINGLE 2X2 QF
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | -40°C ~ 150°C (TJ) | 6-VDFN Exposed Pad | 6-DFN (2x2) | Surface Mount | Inverting | Single | High-Side or Low-Side | 1 | N-Channel，P-Channel MOSFET | - | 11.5ns，10ns | 0.8V，2V | 1.5A，1.5A | |||
|
|
Microchip Technology |
2,995
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MOSFET DVR 1.5A SINGLE 2X2 QF
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | -40°C ~ 150°C (TJ) | 6-VDFN Exposed Pad | 6-DFN (2x2) | Surface Mount | Inverting | Single | High-Side or Low-Side | 1 | N-Channel，P-Channel MOSFET | - | 11.5ns，10ns | 0.8V，2V | 1.5A，1.5A | |||
|
|
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MOSFET DVR 1.5A SINGLE 2X2 QF
|
- | - | 4.5 V ~ 18 V | -40°C ~ 150°C (TJ) | 6-VDFN Exposed Pad | 6-DFN (2x2) | Surface Mount | Inverting | Single | High-Side or Low-Side | 1 | N-Channel，P-Channel MOSFET | - | 11.5ns，10ns | 0.8V，2V | 1.5A，1.5A | |||
|
|
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 2500 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Inverting | Independent | High-Side | 2 | IGBT | - | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
2,498
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Inverting | Independent | High-Side | 2 | IGBT | - | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
2,498
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Inverting | Independent | High-Side | 2 | IGBT | - | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 2500 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
2,475
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
2,475
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 2500 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Inverting，Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
2,387
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Inverting，Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
2,387
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-TSSOP，8-MSOP (0.118"，3.00mm Width) | 8-MSOP | Surface Mount | Inverting，Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 3000 MPQ: 1
|
IC MOSFET DVR 1.5A SINGLE 2X2 QF
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | -40°C ~ 150°C (TJ) | 6-VDFN Exposed Pad | 6-DFN (2x2) | Surface Mount | Non-Inverting | Single | High-Side or Low-Side | 1 | N-Channel，P-Channel MOSFET | - | 11.5ns，10ns | 0.8V，2V | 1.5A，1.5A | |||
|
|
Microchip Technology |
2,341
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
IC MOSFET DVR 1.5A SINGLE 2X2 QF
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | -40°C ~ 150°C (TJ) | 6-VDFN Exposed Pad | 6-DFN (2x2) | Surface Mount | Non-Inverting | Single | High-Side or Low-Side | 1 | N-Channel，P-Channel MOSFET | - | 11.5ns，10ns | 0.8V，2V | 1.5A，1.5A | |||
|
|
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
IC MOSFET DVR 1.5A SINGLE 2X2 QF
|
- | - | 4.5 V ~ 18 V | -40°C ~ 150°C (TJ) | 6-VDFN Exposed Pad | 6-DFN (2x2) | Surface Mount | Non-Inverting | Single | High-Side or Low-Side | 1 | N-Channel，P-Channel MOSFET | - | 11.5ns，10ns | 0.8V，2V | 1.5A，1.5A | |||
|
|
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 3300 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Tape & Reel (TR) | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
3,250
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
Cut Tape (CT) | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
3,250
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
3.0A MATCHED，HIGH -SPEED，LOW-S
|
- | - | 4.5 V ~ 18 V | -40°C ~ 125°C | 8-WFDFN Exposed Pad | 8-TDFN (2x3) | Surface Mount | Non-Inverting | Independent | High-Side | 2 | IGBT | - | 12ns，12ns | 0.8V，2V | 3A，3A | |||
|
|
Microchip Technology |
inchiesta
|
- |
-
|
MOQ: 2500 MPQ: 1
|
IC DRIVER MOSFET 1.5A DUAL 8SOIC
|
Tape & Reel (TR) | - | 4.5 V ~ 20 V | -40°C ~ 125°C (TJ) | 8-SOIC (0.154"，3.90mm Width) Exposed Pad | 8-SOIC-EP | Surface Mount | Inverting，Non-Inverting | Independent | Low-Side | 2 | N-Channel MOSFET | - | 20ns，18ns | 0.8V，2.4V | 1.5A，1.5A |
