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- Operating Temperature：
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- Material：
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- Height：
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- Length：
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- Plating：
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- Condizioni selezionate:
Scopri i prodotti 1,795
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 6.0X4.3MM
|
- | - | Shield Finger | - | - | 0.235" (5.97mm) | 0.235" (5.97mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
1,511
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 6.0X4.3MM
|
- | - | Shield Finger | - | - | 0.235" (5.97mm) | 0.235" (5.97mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
1,511
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT BECU 6.0X4.3MM
|
- | - | Shield Finger | - | - | 0.235" (5.97mm) | 0.235" (5.97mm) | - | - | - | ||
|
|
|
Wurth Electronics Inc. |
1,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.276" (7.00mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,365
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.276" (7.00mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,365
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.276" (7.00mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
- | - | Shield Clip | Beryllium Copper | 0.100" (2.54mm) | 0.374" (9.50mm) | 0.090" (2.28mm) | Gold | - | Solder | ||
|
|
|
Laird Technologies EMI |
3,499
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
- | - | Shield Clip | Beryllium Copper | 0.100" (2.54mm) | 0.374" (9.50mm) | 0.090" (2.28mm) | Gold | - | Solder | ||
|
|
|
Laird Technologies EMI |
3,499
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT RETAINER FOR BOARDSHIELD
|
- | - | Shield Clip | Beryllium Copper | 0.100" (2.54mm) | 0.374" (9.50mm) | 0.090" (2.28mm) | Gold | - | Solder | ||
|
|
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PulseLarsen Antennas |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
ANTENNA
|
- | - | Shield Clip | - | 0.057" (1.45mm) | 0.126" (3.20mm) | 0.059" (1.50mm) | - | - | Clip | ||
|
|
|
PulseLarsen Antennas |
10,922
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
ANTENNA
|
- | - | Shield Clip | - | 0.057" (1.45mm) | 0.126" (3.20mm) | 0.059" (1.50mm) | - | - | Clip | ||
|
|
|
PulseLarsen Antennas |
10,922
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
ANTENNA
|
- | - | Shield Clip | - | 0.057" (1.45mm) | 0.126" (3.20mm) | 0.059" (1.50mm) | - | - | Clip | ||
|
|
|
Wurth Electronics Inc. |
600
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.512" (13.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
888
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.512" (13.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
888
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.512" (13.00mm) | 0.276" (7.00mm) | 0.098" (2.50mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
36
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGRSTCK BECU ALY 7.57X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.100" (2.54mm) | 16.000" (406.40mm) | 0.300" (7.62mm) | - | - | Clip | ||
|
|
|
Laird Technologies EMI |
85
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.4X406.4MM
|
No Snag | 121°C | Fingerstock | Beryllium Copper | 0.130" (3.30mm) | 16.000" (406.40mm) | 0.370" (9.40mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
55
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X609.6MM
|
No Snag | 121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 24.000" (609.60mm) | 0.280" (7.11mm) | - | - | Adhesive | ||
|
|
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Laird Technologies EMI |
60
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 2.79X609.6MM
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.200" (5.08mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
79
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Twist | 121°C | Fingerstock | Beryllium Copper | 0.030" (0.76mm) | 24.000" (609.60mm) | 0.230" (5.84mm) | Unplated | - | Adhesive |
