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- Operating Temperature：
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- Height：
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- Plating：
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- Condizioni selezionate:
Scopri i prodotti 1,795
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Height | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Wurth Electronics Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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CONTACT FINGER EMI SMD
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WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.189" (4.80mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
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Wurth Electronics Inc. |
958
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3 giorni |
-
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MOQ: 1 MPQ: 1
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CONTACT FINGER EMI SMD
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WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.189" (4.80mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
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Wurth Electronics Inc. |
958
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3 giorni |
-
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MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.189" (4.80mm) | 0.177" (4.50mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
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Wurth Electronics Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
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WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.157" (4.00mm) | 0.236" (6.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
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Wurth Electronics Inc. |
546
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.157" (4.00mm) | 0.236" (6.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
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Wurth Electronics Inc. |
546
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3 giorni |
-
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MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.157" (4.00mm) | 0.236" (6.00mm) | 0.079" (2.00mm) | Gold | Flash | Solder | ||
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Wurth Electronics Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
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WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.394" (10.00mm) | 0.236" (6.00mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
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Wurth Electronics Inc. |
728
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
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WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.394" (10.00mm) | 0.236" (6.00mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
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Wurth Electronics Inc. |
728
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
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WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.394" (10.00mm) | 0.236" (6.00mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
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Laird Technologies EMI |
97
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3 giorni |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 27.69MMX406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 16.000" (406.40mm) | 1.090" (27.69mm) | - | - | Hardware，Rivet，Solder | ||
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Harwin Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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RFI SHIELD FINGER AU 3MM SMD
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EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | 0.118" (3.00mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
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Harwin Inc. |
56
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3 giorni |
-
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MOQ: 1 MPQ: 1
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RFI SHIELD FINGER AU 3MM SMD
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EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | 0.118" (3.00mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
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Harwin Inc. |
56
|
3 giorni |
-
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MOQ: 1 MPQ: 1
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RFI SHIELD FINGER AU 3MM SMD
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EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | 0.118" (3.00mm) | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
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Laird Technologies EMI |
22
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3 giorni |
-
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MOQ: 1 MPQ: 1
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FINGRSTOCK BECU ALY 7.57X609.6MM
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Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.300" (7.62mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 12.7X609.6MM
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Twist | 121°C | Fingerstock | Beryllium Copper | 0.070" (1.78mm) | 24.000" (609.60mm) | 0.500" (12.70mm) | - | - | Adhesive | ||
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Harwin Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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RFI SHIELD CLIP MINI TIN SMD
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- | -40°C ~ 85°C | Shield Clip | Stainless Steel | 0.050" (1.28mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
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Harwin Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
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- | -40°C ~ 85°C | Shield Clip | Stainless Steel | 0.050" (1.28mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
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Harwin Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
RFI SHIELD CLIP MINI TIN SMD
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- | -40°C ~ 85°C | Shield Clip | Stainless Steel | 0.050" (1.28mm) | 0.154" (3.90mm) | 0.043" (1.10mm) | Tin | 118.11μin (3.00μm) | Solder | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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CONTACT BECU 3.3X1.0MM
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- | - | - | - | - | - | - | - | - | - | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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CONTACT BECU 3.3X1.0MM
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- | - | - | - | - | - | - | - | - | - |
