Contatti, Fingerstock e Guarnizioni - Zui Ai Technology（Taiwan）Company.

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Attachment Method：

immagine	Numero di parte	fabbricante	quantità	Periodo di consegna	Prezzo unitario	acquistare	descrizione	Series	Operating Temperature	Type	Material	Height	Length	Width	Plating	Plating - Thickness	Attachment Method
immagine	Numero di parte	fabbricante	quantità	Periodo di consegna	Prezzo unitario	acquistare	descrizione	Series	Operating Temperature	Type	Material	Height	Length	Width	Plating	Plating - Thickness	Attachment Method
	27229375	Laird Technologies EMI	inchiesta	-	-	LOK ROD 1/2X12 MOQ: 1 MPQ: 1	LOK ROD 1/2X12	-	-	-	-	-	-	-	-	-	-
	6000-0225-72	Leader Tech Inc.	inchiesta	-	-	2.25" X 50 LONG TECHMESH TAPE-- MOQ: 1 MPQ: 1	2.25" X 50 LONG TECHMESH TAPE--	-	-	Gasket Sleeve	-	-	-	2.250" (57.15mm)	Tin	-	-
	8300015044	Laird Technologies EMI	inchiesta	-	-	ELMT,MT,CUTIPLAT,RL MOQ: 1 MPQ: 1	ELMT,MT,CUTIPLAT,RL	-	-	-	-	-	-	-	-	-	-
	23-60FS-BD-400	Leader Tech Inc.	inchiesta	-	-	0.23 X 0.60 BD 400--FOLDED SERIE MOQ: 1 MPQ: 1	0.23 X 0.60 BD 400--FOLDED SERIE	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	0.230" (5.84mm)	33.33 (10.16m)	0.600" (15.24mm)	Unplated	-	Adhesive
	228031300	Laird Technologies EMI	inchiesta	-	-	AP,STR,SNB,RA,CM MOQ: 1 MPQ: 1	AP,STR,SNB,RA,CM	-	-	-	-	-	-	-	-	-	-
	228031000	Laird Technologies EMI	inchiesta	-	-	AP,STR,SNB,RA,CM MOQ: 1 MPQ: 1	AP,STR,SNB,RA,CM	-	-	-	-	-	-	-	-	-	-
	25-109FSDS-SN-300""	Leader Tech Inc.	inchiesta	-	-	0.25 X 1.09 SN 300"--FOLDED SERI MOQ: 1 MPQ: 1	0.25 X 1.09 SN 300"--FOLDED SERI	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	0.250" (6.35mm)	25.00 (7.62m)	1.090" (27.69mm)	Tin	Flash	Adhesive
	228031400	Laird Technologies EMI	inchiesta	-	-	AP,STR,SNB,RA,CM MOQ: 1 MPQ: 1	AP,STR,SNB,RA,CM	-	-	-	-	-	-	-	-	-	-
	25-109FSDS-BD-300	Leader Tech Inc.	inchiesta	-	-	0.25 X 1.09 BD 300"--FOLDED SERI MOQ: 1 MPQ: 1	0.25 X 1.09 BD 300"--FOLDED SERI	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	0.250" (6.35mm)	25.00 (7.62m)	1.090" (27.69mm)	Unplated	-	Adhesive
	25-78FS-BD-300	Leader Tech Inc.	inchiesta	-	-	0.25 X 0.78 BD 300"--FOLDED SERI MOQ: 1 MPQ: 1	0.25 X 0.78 BD 300"--FOLDED SERI	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	0.250" (6.35mm)	25.00 (7.62m)	0.780" (19.81mm)	Unplated	-	Adhesive
	8-25FSC-BD-400	Leader Tech Inc.	inchiesta	-	-	0.08 X 0.25 BD 400--FOLDED SERIE MOQ: 1 MPQ: 1	0.08 X 0.25 BD 400--FOLDED SERIE	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	0.080" (2.03mm)	33.33 (10.16m)	0.250" (6.35mm)	Unplated	-	Adhesive
	228032000	Laird Technologies EMI	inchiesta	-	-	AP,STR,SNB,RA,CM MOQ: 1 MPQ: 1	AP,STR,SNB,RA,CM	-	-	-	-	-	-	-	-	-	-
	228031900	Laird Technologies EMI	inchiesta	-	-	AP,STR,SNB,RA,CM MOQ: 1 MPQ: 1	AP,STR,SNB,RA,CM	-	-	-	-	-	-	-	-	-	-
	228032100	Laird Technologies EMI	inchiesta	-	-	AP,STR,SNB,RA,CM MOQ: 1 MPQ: 1	AP,STR,SNB,RA,CM	-	-	-	-	-	-	-	-	-	-
	228031600	Laird Technologies EMI	inchiesta	-	-	AP,STR,SNB,RA,CM MOQ: 1 MPQ: 1	AP,STR,SNB,RA,CM	-	-	-	-	-	-	-	-	-	-
	228031700	Laird Technologies EMI	inchiesta	-	-	AP,STR,SNB,RA,MOD MOQ: 1 MPQ: 1	AP,STR,SNB,RA,MOD	-	-	-	-	-	-	-	-	-	-
	228031500	Laird Technologies EMI	inchiesta	-	-	AP,STR,SNB,RA,CM MOQ: 1 MPQ: 1	AP,STR,SNB,RA,CM	-	-	-	-	-	-	-	-	-	-
	8643006174	Laird Technologies EMI	inchiesta	-	-	VPEDF,REC ,#8643,CRY MOQ: 1 MPQ: 1	VPEDF,REC ,#8643,CRY	-	-	-	-	-	-	-	-	-	-
	78087129	Laird Technologies EMI	inchiesta	-	-	24"X24"X2-1/4" AN-77 MICROWAVE A MOQ: 1 MPQ: 1	24"X24"X2-1/4" AN-77 MICROWAVE A	-	-	-	-	-	-	-	-	-	-
	114094400	Laird Technologies EMI	inchiesta	-	-	SHLD,PCS,BECU,NISNSAT 0.38X0.75X MOQ: 1 MPQ: 1	SHLD,PCS,BECU,NISNSAT 0.38X0.75X	-	-	-	-	-	-	-	-	-	-

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