- Series：
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- Operating Temperature：
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- Material：
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- Height：
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- Length：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Condizioni selezionate:
Scopri i prodotti 51
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Harwin Inc. |
6,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 2.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.098" (2.50mm) | 0.138" (3.50mm) | Nickel | 51.18μin (1.30μm) | Solder | ||
|
|
|
Harwin Inc. |
11,887
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 2.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.098" (2.50mm) | 0.138" (3.50mm) | Nickel | 51.18μin (1.30μm) | Solder | ||
|
|
|
Harwin Inc. |
11,887
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 2.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.098" (2.50mm) | 0.138" (3.50mm) | Nickel | 51.18μin (1.30μm) | Solder | ||
|
|
|
Harwin Inc. |
8,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.059" (1.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,301
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.059" (1.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
8,301
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.5MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | 0.059" (1.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
4,500
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.224" (5.70mm) | 0.185" (4.70mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
4,584
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.224" (5.70mm) | 0.185" (4.70mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
4,584
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.224" (5.70mm) | 0.185" (4.70mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,500
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.209" (5.30mm) | 0.157" (4.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,637
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.209" (5.30mm) | 0.157" (4.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,637
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.209" (5.30mm) | 0.157" (4.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
123
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONDUCTIVE NI/CU GLASS SLEEVE 1M
|
WE-ST | -60°C ~ 160°C | Gasket Sleeve | Nickel-Copper (NI/CU) Glass Fiber | - | 39.370" (1.00m) | - | - | - | ||
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|
|
Molex，LLC |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.40MM - 0.80MM H
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.043" (1.10mm) | 0.154" (3.90mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Molex，LLC |
6,926
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.40MM - 0.80MM H
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.043" (1.10mm) | 0.154" (3.90mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Molex，LLC |
6,926
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SPRING CONTACT 0.40MM - 0.80MM H
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | 0.043" (1.10mm) | 0.154" (3.90mm) | Gold | 19.685μin (0.50μm) | Solder | ||
|
|
|
Wurth Electronics Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.118" (3.00mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
2,476
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.118" (3.00mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
2,476
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.118" (3.00mm) | 0.118" (3.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | 0.098" (2.50mm) | 0.118" (3.00mm) | Gold | Flash | Solder |
