Contatti, Fingerstock e Guarnizioni - Zui Ai Technology（Taiwan）Company.

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Operating Temperature：

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Attachment Method：

immagine	Numero di parte	fabbricante	quantità	Periodo di consegna	Prezzo unitario	acquistare	descrizione	Series	Operating Temperature	Type	Material	Shape	Length	Width	Plating	Plating - Thickness	Attachment Method
immagine	Numero di parte	fabbricante	quantità	Periodo di consegna	Prezzo unitario	acquistare	descrizione	Series	Operating Temperature	Type	Material	Shape	Length	Width	Plating	Plating - Thickness	Attachment Method
	98095415	Laird Technologies EMI	inchiesta	-	-	S3,STR,ZNC,USFT,PSA MOQ: 1 MPQ: 1	S3,STR,ZNC,USFT,PSA	-	121°C	Fingerstock	Beryllium Copper	-	15.000" (381.00mm)	0.450" (11.43mm)	Zinc + Clear Chromate	299.21μin (7.60μm)	Adhesive
	98095417	Laird Technologies EMI	inchiesta	-	-	S3,STR,SNB,USFT,PSA MOQ: 1 MPQ: 1	S3,STR,SNB,USFT,PSA	-	121°C	Fingerstock	Beryllium Copper	-	15.000" (381.00mm)	0.450" (11.43mm)	Tin	299.21μin (7.60μm)	Adhesive
	98052102	Laird Technologies EMI	inchiesta	-	-	NOSG,STR,BF,USFT,PSA MOQ: 1 MPQ: 1	NOSG,STR,BF,USFT,PSA	Foldover	121°C	Fingerstock	Beryllium Copper	-	16.000" (406.40mm)	0.510" (12.95mm)	-	-	Adhesive
	98095517	Laird Technologies EMI	inchiesta	-	-	S3,STR,SNB,USFT,RIV MOQ: 1 MPQ: 1	S3,STR,SNB,USFT,RIV	-	121°C	Fingerstock	Beryllium Copper	-	15.000" (381.00mm)	0.450" (11.43mm)	Tin	299.21μin (7.60μm)	Adhesive
	98052002	Laird Technologies EMI	inchiesta	-	-	AP,STR,BF,USF,PSA MOQ: 1 MPQ: 1	AP,STR,BF,USF,PSA	-	121°C	Fingerstock	Beryllium Copper	-	16.000" (406.40mm)	0.370" (9.40mm)	-	-	Adhesive
	98095502	Laird Technologies EMI	inchiesta	-	-	S3,STR,BF,USF,RIV MOQ: 1 MPQ: 1	S3,STR,BF,USF,RIV	-	121°C	Fingerstock	Beryllium Copper	-	15.000" (381.00mm)	0.450" (11.43mm)	-	-	Adhesive
	14-S-51FSC-BD-16	Leader Tech Inc.	inchiesta	-	-	0.14 X 0.51 BD 16--FOLDED SERIES MOQ: 1 MPQ: 1	0.14 X 0.51 BD 16--FOLDED SERIES	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	16.000" (406.40mm)	0.510" (12.95mm)	Unplated	-	Adhesive
	14-37FSV30-BD-16	Leader Tech Inc.	inchiesta	-	-	0.14 X 0.37 BD 16--FOLDED SERIES MOQ: 1 MPQ: 1	0.14 X 0.37 BD 16--FOLDED SERIES	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	16.000" (406.40mm)	0.370" (9.40mm)	Unplated	-	Adhesive
	0C97052117	Laird Technologies EMI	inchiesta	-	-	NOSG COIL SNB PSA MOQ: 1 MPQ: 1	NOSG COIL SNB PSA	Foldover	121°C	Fingerstock	Beryllium Copper	-	16.000" (406.40mm)	0.510" (12.95mm)	Tin	299.21μin (7.60μm)	Adhesive
	98052017	Laird Technologies EMI	inchiesta	-	-	AP,STR,SNB,USFT,PSA MOQ: 1 MPQ: 1	AP,STR,SNB,USFT,PSA	-	121°C	Fingerstock	Beryllium Copper	-	16.000" (406.40mm)	0.370" (9.40mm)	Tin	299.21μin (7.60μm)	Adhesive
	98052019	Laird Technologies EMI	inchiesta	-	-	AP,STR,NIB,USFT,PSA MOQ: 1 MPQ: 1	AP,STR,NIB,USFT,PSA	-	121°C	Fingerstock	Beryllium Copper	-	16.000" (406.40mm)	0.370" (9.40mm)	Nickel	299.21μin (7.60μm)	Adhesive
	14-S-37FSV30-BD-16	Leader Tech Inc.	inchiesta	-	-	0.14 X 0.37 BD 16--FOLDED SERIES MOQ: 1 MPQ: 1	0.14 X 0.37 BD 16--FOLDED SERIES	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	16.000" (406.40mm)	0.370" (9.40mm)	Unplated	-	Adhesive
	14-51FSC-BD-16	Leader Tech Inc.	inchiesta	-	-	0.14 X 0.510 BD 16--FOLDED SERIE MOQ: 1 MPQ: 1	0.14 X 0.510 BD 16--FOLDED SERIE	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	16.000" (406.40mm)	0.510" (12.95mm)	Unplated	-	Adhesive
	14-45DT-BD-15	Leader Tech Inc.	inchiesta	-	-	0.14 X 0.45 BD 15--14-45DT-BD-15 MOQ: 1 MPQ: 1	0.14 X 0.45 BD 15--14-45DT-BD-15	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	15.000" (381.00mm)	0.450" (11.43mm)	Unplated	-	Adhesive
	14-S-37FS-BD-16	Leader Tech Inc.	inchiesta	-	-	0.14 X 0.36 BD 16--FOLDED SERIES MOQ: 1 MPQ: 1	0.14 X 0.36 BD 16--FOLDED SERIES	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	16.000" (406.40mm)	0.370" (9.40mm)	Unplated	-	Adhesive
	14-37FSV30-SN-16	Leader Tech Inc.	inchiesta	-	-	0.14 X 0.37 SN 16--FOLDED SERIES MOQ: 1 MPQ: 1	0.14 X 0.37 SN 16--FOLDED SERIES	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	16.000" (406.40mm)	0.370" (9.40mm)	Tin	Flash	Adhesive
	14-37FS-SN-16	Leader Tech Inc.	inchiesta	-	-	0.14 X 0.36 BD SN 16--FOLDED SER MOQ: 1 MPQ: 1	0.14 X 0.36 BD SN 16--FOLDED SER	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	16.000" (406.40mm)	0.370" (9.40mm)	Tin	Flash	Adhesive
	14-S-37FSV30-SN-16	Leader Tech Inc.	inchiesta	-	-	0.14 X 0.37 SN 16--FOLDED SERIES MOQ: 1 MPQ: 1	0.14 X 0.37 SN 16--FOLDED SERIES	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	16.000" (406.40mm)	0.370" (9.40mm)	Tin	Flash	Adhesive
	14-S-37FS-SN-16	Leader Tech Inc.	inchiesta	-	-	0.14 X 0.36 SN 16--FOLDED SERIES MOQ: 1 MPQ: 1	0.14 X 0.36 SN 16--FOLDED SERIES	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	16.000" (406.40mm)	0.370" (9.40mm)	Tin	Flash	Adhesive
	14-51FSC-NI-16	Leader Tech Inc.	inchiesta	-	-	0.14 X 0.510 NI 16--FOLDED SERIE MOQ: 1 MPQ: 1	0.14 X 0.510 NI 16--FOLDED SERIE	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	16.000" (406.40mm)	0.510" (12.95mm)	Nickel	Flash	Adhesive

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