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Scopri i prodotti 74
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Leader Tech Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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0.14 X 0.51 SN 16.0--FOLDED SERI
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.510" (12.95mm) | Tin | Flash | Adhesive | |||
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,SNB,USFT,RIVIT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 15.000" (381.00mm) | 0.450" (11.43mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,NIB,USFT,RIV
|
- | 121°C | Fingerstock | Beryllium Copper | - | 15.000" (381.00mm) | 0.450" (11.43mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.14 X 0.37 NI 16--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.370" (9.40mm) | Nickel | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.14 X 0.36 AG 16--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.370" (9.40mm) | Silver | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.14 X 0.45 BD 15 NTP--14-45DTS-
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 15.000" (381.00mm) | 0.450" (11.43mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.14 X 0.45 SN 16--14-45DT-SN-16
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.450" (11.43mm) | Tin | Flash | Adhesive | |||
|
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Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
.140"H X .250"W X 48"L--D SHAPED
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | D-Shape | 4.00 (1.22m) | 0.250" (6.35mm) | - | - | - | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
.140"H X 250"W 48"L--RECTANGULAR
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 4.00 (1.22m) | 0.250" (6.35mm) | - | - | - | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.14 X 0.38 SN 16--14-38AH-SN-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.380" (9.65mm) | Tin | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.14 X 0.38 ZINC 16--14-38AH-ZIN
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.380" (9.65mm) | Zinc + Clear Chromate | Flash | Adhesive | |||
|
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Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
.140"H X .200" W X 48"L--OVAL--C
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Oval | 4.00 (1.22m) | 0.200" (5.08mm) | - | - | - | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.14 X 0.36 BD 300"--FOLDED SERI
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 25.00 (7.62m) | 0.370" (9.40mm) | Unplated | - | Adhesive | |||
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL CDY PSA
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All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.370" (9.40mm) | Cadmium + Yellow Chromate | 299.21μin (7.60μm) | Adhesive |
