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- Operating Temperature：
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- Condizioni selezionate:
Scopri i prodotti 43
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
527
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3 giorni |
-
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MOQ: 1 MPQ: 1
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GASKET BECU ALLOY 11.43X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.450" (11.43mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
491
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 6.35X406.4MM
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 11.176X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.440" (11.18mm) | - | - | Clip | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 11.176X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.440" (11.18mm) | - | - | Clip | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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FINGERSTCK ULTRASFT 6.35X406.4MM
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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FINGERSTOCK BECU 10.67X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.420" (10.67mm) | - | - | Clip | ||
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Leader Tech Inc. |
93
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3 giorni |
-
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MOQ: 1 MPQ: 1
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COPPER BERYLLIUM FINGERSTOCK EMI
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- | - | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | - | |||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
CLO,STR,BF,USFT
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Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.440" (11.18mm) | - | - | Clip | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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NOSG,STR,BF,USF,PSA
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.262" (6.67mm) | 0.450" (11.43mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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CLO,STRSNB,USFT
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Clip-On | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.440" (11.18mm) | Tin | 299.21μin (7.60μm) | Clip | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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NOSG COIL BF PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.250" (6.35mm) | Unplated | - | Adhesive | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG,STR,ZNC,USFT,PSA
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.262" (6.67mm) | 0.450" (11.43mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,USFT,PSA
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.262" (6.67mm) | 0.450" (11.43mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,USFT,PSA
|
Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.262" (6.67mm) | 0.450" (11.43mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.262" (6.67mm) | 0.450" (11.43mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.250" (6.35mm) | - | - | Adhesive | ||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL SNB PSA
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Foldover | 121°C | Fingerstock | Beryllium Copper | - | 25.000 (7.62m) | 0.250" (6.35mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,ZNC,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.250" (6.35mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.250" (6.35mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 0.250" (6.35mm) | Nickel | 299.21μin (7.60μm) | Adhesive |
