- Series:
-
- Operating Temperature:
-
- Length:
-
- Plating:
-
- Plating - Thickness:
-
- Attachment Method:
-
- Condizioni selezionate:
Scopri i prodotti 16
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Length | Width | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
315
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 28.7X304.8MM
|
- | 121°C | 12.000" (304.80mm) | 1.130" (28.70mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 28.7X304.8MM
|
- | 121°C | 12.000" (304.80mm) | 1.130" (28.70mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 28.7X304.8MM
|
- | 121°C | 12.000" (304.80mm) | 1.130" (28.70mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR,STR,BF
|
- | 121°C | 25.000 (7.60m) | 1.630" (41.40mm) | - | - | Hardware,Rivet,Solder | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL SNB
|
Large Enclosure | 121°C | 25.000 (7.62m) | 1.630" (41.40mm) | Tin | 299.21μin (7.60μm) | Hardware,Rivet,Solder | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNSAT,PSA
|
- | 121°C | 12.000" (304.80mm) | 1.130" (28.70mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.41 X 1.13 BD 12--FOLDED SERIES
|
- | -55°C ~ 121°C | 12.000" (304.80mm) | 1.130" (28.70mm) | Unplated | - | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL NIE
|
Large Enclosure | 121°C | 25.000 (7.62m) | 1.630" (41.40mm) | Nickel | 299.21μin (7.60μm) | Hardware,Rivet,Solder | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,USFT,PSA
|
- | 121°C | 12.000" (304.80mm) | 1.130" (28.70mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.41 X 1.13 X BD 12--FOLDED SERI
|
- | -55°C ~ 121°C | 12.000" (304.80mm) | 1.130" (28.70mm) | Unplated | - | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CSTR COIL BF USF
|
Large Enclosure | 121°C | 25.000 (7.62m) | 1.630" (41.40mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.41 X 1.13 SN 12--FOLDED SERIES
|
- | -55°C ~ 121°C | 12.000" (304.80mm) | 1.130" (28.70mm) | Tin | Flash | Adhesive | ||||
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.41 X 1.13 BD 16--FOLDED SERIES
|
- | -55°C ~ 121°C | 16.000" (406.40mm) | 1.130" (28.70mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.41 X 1.13 X BD 16--FOLDED SERI
|
- | -55°C ~ 121°C | 16.000" (406.40mm) | 1.130" (28.70mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.41 X 1.63 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | 16.000" (406.40mm) | 1.630" (41.40mm) | Unplated | - | Adhesive | ||||
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.41 X 1.13 X SN 16--FOLDED SERI
|
- | -55°C ~ 121°C | 16.000" (406.40mm) | 1.130" (28.70mm) | Tin | Flash | Adhesive |