- Series：
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- Operating Temperature：
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- Type：
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- Material：
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- Length：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Condizioni selezionate:
Scopri i prodotti 77
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
ITT Cannon，LLC |
156,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.192" (4.87mm) | 0.043" (1.10mm) | Gold | 5.906μin (0.15μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
160,470
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.192" (4.87mm) | 0.043" (1.10mm) | Gold | 5.906μin (0.15μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
160,470
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 2.5MM SMD
|
- | - | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.192" (4.87mm) | 0.043" (1.10mm) | Gold | 5.906μin (0.15μm) | Solder | ||
|
|
|
Harwin Inc. |
7,500
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 2.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.213" (5.40mm) | 0.122" (3.10mm) | Tin | 157.48μin (4.00μm) | Solder | ||
|
|
|
Harwin Inc. |
9,070
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 2.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.213" (5.40mm) | 0.122" (3.10mm) | Tin | 157.48μin (4.00μm) | Solder | ||
|
|
|
Harwin Inc. |
9,070
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 2.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Clip | Stainless Steel | - | 0.213" (5.40mm) | 0.122" (3.10mm) | Tin | 157.48μin (4.00μm) | Solder | ||
|
|
|
Harwin Inc. |
6,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 2.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.138" (3.50mm) | 0.079" (2.00mm) | Nickel | 51.18μin (1.30μm) | Solder | ||
|
|
|
Harwin Inc. |
11,887
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 2.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.138" (3.50mm) | 0.079" (2.00mm) | Nickel | 51.18μin (1.30μm) | Solder | ||
|
|
|
Harwin Inc. |
11,887
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER TIN 2.5MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.138" (3.50mm) | 0.079" (2.00mm) | Nickel | 51.18μin (1.30μm) | Solder | ||
|
|
|
Harwin Inc. |
7,500
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
11,083
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
11,083
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.5MM SMD
|
EZ BoardWare | -20°C ~ 70°C | Shield Finger | Phosphor Bronze | - | 0.181" (4.60mm) | 0.091" (2.30mm) | Gold | Flash | Solder | ||
|
|
|
ITT Cannon，LLC |
498,400
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 2.5MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.144" (3.66mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
499,117
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 2.5MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.144" (3.66mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
499,117
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 2.5MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.144" (3.66mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
Laird Technologies EMI |
731
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
GASKET FAB/FOAM 9.5X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.374" (9.50mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
981
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
GASKT FAB/FOAM 7.62X457.2MM BELL
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Bell | 18.000" (457.20mm) | 0.299" (7.60mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
361
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
GASKT FAB/FOAM 12.7X457.2MM RECT
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | Rectangle | 18.000" (457.20mm) | 0.500" (12.70mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
181
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
GASKT FAB/FOAM 7.62X457.2MM BELL
|
- | - | Fabric Over Foam | - | Bell | 18.000" (457.20mm) | 0.299" (7.60mm) | - | - | Adhesive | ||
|
|
|
Leader Tech Inc. |
2,100
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | - | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.098" (2.50mm) | 0.118" (3.00mm) | - | - | - |
