fabbricante:
Scopri i prodotti 62
immagine Numero di parte fabbricante quantità Periodo di consegna Prezzo unitario acquistare descrizione Series Operating Temperature Type Material Shape Length Width Plating Plating - Thickness Attachment Method
77003319
Laird Technologies EMI
inchiesta
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-
MOQ: 1  MPQ: 1
NOSG,STR,NIB,PSA
Slot Mount 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.370" (9.40mm) Nickel 299.21μin (7.60μm) Slot
78003317
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
NOSG,STR,SNB,USFT,PSA
Slot Mount 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.370" (9.40mm) Tin 299.21μin (7.60μm) Slot
77008317
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
NOSG,STR,SNB,PSA
No Snag 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.370" (9.40mm) Tin 299.21μin (7.60μm) Adhesive
4906AB51K07200
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
GK NICU NRS PU V0 DSH
- - Fabric Over Foam Polyurethane Foam,Nickel-Copper Polyester (NI/CU) D-Shape 72.000" (182.88cm) 0.189" (4.80mm) - - -
4693AB51G09600
Laird Technologies EMI
inchiesta
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-
MOQ: 1  MPQ: 1
GK NICU NRSG PU V0 REC
- - Fabric Over Foam - Rectangle 96.000" (243.84cm) 0.189" (4.80mm) - - -
77008419
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
NOSG,STR,NIB,PSA
No Snag 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.370" (9.40mm) Tin 299.21μin (7.60μm) Adhesive
4117AB51S09600
Laird Technologies EMI
inchiesta
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-
MOQ: 1  MPQ: 1
GK SNCU NRS PU V0 JSH
- - Fabric Over Foam - J-Shape 96.000" (243.84cm) 0.130" (3.30mm) - - -
11-78R2-NI-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.125 X 0.78 NI 16--11-78R2-NI-1
- -55°C ~ 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.780" (19.81mm) Nickel Flash Adhesive
13-30RH-SN-0.356
Leader Tech Inc.
inchiesta
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-
MOQ: 1  MPQ: 1
0.13 X 0.30 SN 0.356--13-30RH-SN
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.356" (9.04mm) 0.300" (7.62mm) Tin Flash Adhesive
13-S-37AH-ST-16
Leader Tech Inc.
inchiesta
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-
MOQ: 1  MPQ: 1
0.13 X 0.37 ST 16.0--13-S-37AH-S
- -55°C ~ 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.370" (9.40mm) Tin Flash Adhesive
13-37RH-BD-16
Leader Tech Inc.
inchiesta
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-
MOQ: 1  MPQ: 1
0.13 X 0.37 BD 16--13-37RH-BD-16
- -55°C ~ 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.370" (9.40mm) Unplated - Adhesive
13-S-37RH-BD-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.13 X 0.37 BD 16--13-S-37RH-BD-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.370" (9.40mm) Unplated - Adhesive
13-37AH-BD-16
Leader Tech Inc.
inchiesta
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-
MOQ: 1  MPQ: 1
0.13 X 0.37 BD 16--13-37AH-BD-16
- -55°C ~ 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.370" (9.40mm) Unplated - Adhesive
13-S-37AH-BD-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.13 X 0.37 BD 16--13-S-37AH-BD-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.370" (9.40mm) Unplated - Adhesive
11-78R2-BD-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.125 X 0.78 BD 16--11-78R2-BD-1
- -55°C ~ 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.780" (19.81mm) Unplated - Adhesive
13-37AH-SN-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.13 X 0.37 SN 16.0--13-37AH-SN-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.370" (9.40mm) Tin Flash Adhesive
13-37AH-NI-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.13 X 0.37 NI 16--13-37AH-NI-16
- -55°C ~ 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.370" (9.40mm) Nickel Flash Adhesive
13-28U-BD-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.13 X 0.281 BD 16--13-28U-BD-16
- -55°C ~ 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.280" (7.11mm) Unplated - Adhesive
11-78R2-MAG-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.125 X 0.78 MAG 16--11-78R2-MAG
- -55°C ~ 121°C Fingerstock Beryllium Copper - 16.000" (406.40mm) 0.780" (19.81mm) Silver Flash Adhesive
SG130256B-36.00
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
.130H X .256"W X 36"L--BELL SHAP
- -40°C ~ 70°C Fabric Over Foam Polyurethane Foam,Nickel-Copper Polyester (NI/CU) Bell 36.000" (914.40mm) 0.256" (6.50mm) - - -