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- Operating Temperature：
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Scopri i prodotti 53
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Length | Width | Plating | Plating - Thickness | Attachment Method | |
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Leader Tech Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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0.25 X 0.78 X 0.50 SN 24--FOLDED
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Tin | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 0.78 SN 24--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Tin | Flash | Adhesive | |||
|
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Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 SU 24--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 0.78 X 0.50 SU 24--FOLDED
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 24.000" (609.60mm) | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
|
CSTR COIL ZNY
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Large Enclosure | 121°C | Fingerstock | Beryllium Copper | - | 25.000 (7.62m) | 1.090" (27.69mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Hardware，Rivet，Solder | |||
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Leader Tech Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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.250"H X .375"W X 24"L--RECTANGU
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 24.000" (609.60mm) | 0.375" (9.53mm) | - | - | - | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 120 NI 16--25-109C
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 1.090" (27.69mm) | Nickel | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
.250"H X .600" X 48"L--RECTANGUL
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 4.00 (1.22m) | 0.600" (15.24mm) | - | - | - | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 1.09 X 130 SN 16--25-109C
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 16.000" (406.40mm) | 1.090" (27.69mm) | Tin | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 1.09 SU 300"--FOLDED SERI
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 25.00 (7.62m) | 1.090" (27.69mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 1.09 SN 300"--FOLDED SERI
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 25.00 (7.62m) | 1.090" (27.69mm) | Tin | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 1.09 BD 300"--FOLDED SERI
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 25.00 (7.62m) | 1.090" (27.69mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 BD 300"--FOLDED SERI
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 25.00 (7.62m) | 0.780" (19.81mm) | Unplated | - | Adhesive |
