- Operating Temperature：
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- Material：
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- Height：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Condizioni selezionate:
Scopri i prodotti 28
 |
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Operating Temperature | Type | Material | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Operating Temperature | Type | Material | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
157
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 3.18X304.8MM
|
- | - | - | - | 0.125" (3.18mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
156
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.6X304.8MM
|
- | - | - | - | 0.063" (1.60mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
221
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.7X304.8MM
|
- | - | - | - | 0.067" (1.70mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
315
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 28.7X304.8MM
|
121°C | Fingerstock | Beryllium Copper | 0.410" (10.41mm) | 1.130" (28.70mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
1,428
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.6X304.8MM
|
- | - | - | - | 0.063" (1.60mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
333
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.7X304.8MM
|
- | - | - | - | 0.067" (1.70mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
1
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 1.6X304.8MM
|
- | Fingerstock | Beryllium Copper | 0.055" (1.40mm) | 0.183" (4.65mm) | Unplated | - | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 28.7X304.8MM
|
121°C | Fingerstock | Beryllium Copper | 0.410" (10.41mm) | 1.130" (28.70mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 28.7X304.8MM
|
121°C | Fingerstock | Beryllium Copper | 0.410" (10.41mm) | 1.130" (28.70mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
Leader Tech Inc. |
67
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | Fingerstock | Beryllium Copper | - | 0.310" (7.87mm) | - | - | - | |||
|
|
Leader Tech Inc. |
99
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
COPPER BERYLLIUM FINGERSTOCK EMI
|
- | Fingerstock | Beryllium Copper | - | 0.310" (7.87mm) | Tin | - | - | |||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SNB,RA
|
121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 0.780" (19.81mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIB,RA
|
121°C | Fingerstock | Beryllium Copper | 0.250" (6.35mm) | 0.780" (19.81mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
DES,STR,SNB,CLO
|
- | - | - | - | 0.062" (1.59mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
DES,STR,NIE,CLO
|
- | - | - | - | 0.062" (1.59mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
DES,STR,NIB,CLO
|
- | - | - | - | 0.062" (1.59mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
DES,STR,SNB,CLO
|
- | - | - | - | 0.183" (4.65mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
DES,STR,ZNC,CLO
|
- | - | - | - | 0.183" (4.65mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNSAT,PSA
|
121°C | Fingerstock | Beryllium Copper | 0.410" (10.41mm) | 1.130" (28.70mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
GK NICU CF PROF V0
|
- | Fabric Over Foam | - | 0.060" (1.52mm) | 5.000" (127.00mm) | - | - | - |
