- Operating Temperature:
-
- Type:
-
- Material:
-
- Width:
-
- Plating:
-
- Plating - Thickness:
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- Attachment Method:
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- Condizioni selezionate:
Scopri i prodotti 72
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Operating Temperature | Type | Material | Height | Width | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Operating Temperature | Type | Material | Height | Width | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
259
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.82X381MM
|
121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 0.620" (15.75mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
56
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 12.20X381MM
|
- | - | - | - | 0.480" (12.20mm) | - | - | - | ||||
Laird Technologies EMI |
74
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 11.43X381MM
|
121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 0.450" (11.43mm) | - | - | Rivet | ||||
Laird Technologies EMI |
94
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.82X381MM
|
- | - | - | - | 0.623" (15.82mm) | - | - | - | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.9X381MM
|
121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 0.350" (8.89mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.9X381MM
|
121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 0.350" (8.89mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 11.43X381MM
|
121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 0.450" (11.43mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 11.43X381MM
|
121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 0.450" (11.43mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.82X381MM
|
121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 0.620" (15.75mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.9X381MM
|
121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 0.350" (8.89mm) | - | - | Rivet | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.9X381MM
|
121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 0.350" (8.89mm) | - | - | Rivet | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 11.43X381MM
|
121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 0.450" (11.43mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.82X381MM
|
121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 0.620" (15.75mm) | - | - | Rivet | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 15.82X381MM
|
121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | 0.620" (15.75mm) | Tin | 299.21μin (7.60μm) | Rivet | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,BF
|
121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 0.350" (8.89mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,BF
|
121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 0.450" (11.43mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,BF
|
121°C | Fingerstock | Beryllium Copper | 0.140" (3.56mm) | 0.450" (11.43mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,SNB,PSA
|
121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 0.350" (8.89mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
S3,STR,SNB
|
121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 0.350" (8.89mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
STS3,STR,ZNC,PSA
|
121°C | Fingerstock | Beryllium Copper | 0.110" (2.79mm) | 0.350" (8.89mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive |