fabbricante:
Scopri i prodotti 422
immagine Numero di parte fabbricante quantità Periodo di consegna Prezzo unitario acquistare descrizione Series Operating Temperature Type Material Shape Height Width Plating Plating - Thickness Attachment Method
22-60AH-SN-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.22 X 0.60 SN 16--22-60AH-SN-16
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.220" (5.59mm) 0.600" (15.24mm) Tin Flash Adhesive
6-45LPH-060-BD-16-NTP
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.06 X 0.45 X 060 BD 16 NTP--6-4
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.060" (1.52mm) 0.450" (11.43mm) Unplated - Adhesive
8-45LPC-060-BD-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.08 X 0.45 X 060 BD 16--8-45LPC
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.080" (2.03mm) 0.450" (11.43mm) Unplated - Adhesive
32-S-78AH-BD-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.32 X 0.78 BD 16--32-S-78AH-BD-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.320" (8.13mm) 0.780" (19.81mm) Unplated - Adhesive
32-S-78AH-SN-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.32 X 0.78 SN 16--32-S-78AH-SN-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.320" (8.13mm) 0.780" (19.81mm) Tin Flash Adhesive
22-S-60RH-BD-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.22 X 0.60 BD 16--22-S-60RH-BD-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.220" (5.59mm) 0.600" (15.24mm) Unplated - Adhesive
12-60LPAH-SN-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.12 X 0.60 SN 16--12-60LPAH-SN-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.120" (3.05mm) 0.600" (15.24mm) Tin Flash Adhesive
10-30C-065-DL-SN-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.10 X 0.30 X 065 SN 16--10-30C-
TechMESH -55°C ~ 121°C Fingerstock Beryllium Copper - 0.100" (2.54mm) 0.300" (7.62mm) Tin Flash Adhesive
4-53D-BD-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.05 X 0.53 BD 16--4-53D-BD-16--
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.040" (1.02mm) 0.530" (13.46mm) Unplated - Adhesive
6-34UT3-070-ST-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.07 X 0.38 X 070 ST 16--TWIST C
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.060" (1.52mm) 0.340" (8.64mm) Tin Flash Adhesive
11-45C-045-SN-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.11 X 0.44 X 045 SN 16--11-45C-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 0.450" (11.43mm) Tin Flash Adhesive
11-45C-050-SN-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.11 X 0.44 X 050 SN 16--11-45C-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 0.450" (11.43mm) Tin Flash Adhesive
11-45C-070-SN-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.11 X 0.44 X 070 SN 16--11-45C-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 0.450" (11.43mm) Tin Flash Adhesive
20-38RBCT-SN-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.20 X 0.377 SN 16--20-38RBCT-SN
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.200" (5.08mm) 0.380" (9.65mm) Tin Flash Adhesive
10-26UD-BD-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.10 X 0.26 BD 16--10-26UD-BD-16
TechMESH -55°C ~ 121°C Fingerstock Beryllium Copper - 0.110" (2.79mm) 0.260" (6.60mm) Unplated - Adhesive
22-60AH-NI-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.22 X 0.60 NI 16--22-60AH-NI-16
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.220" (5.59mm) 0.600" (15.24mm) Nickel Flash Adhesive
22-60RH-SN-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.22 X 0.60 SN 16--22-60RH-SN-16
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.220" (5.59mm) 0.600" (15.24mm) Tin Flash Adhesive
10-30C-065-DL-NI-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.10 X 0.30 X 065 NI 16--10-30C-
TechMESH -55°C ~ 121°C Fingerstock Beryllium Copper - 0.100" (2.54mm) 0.300" (7.62mm) Nickel Flash Adhesive
16-44UD-BD-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.16 X 0.44 BD 16--16-44UD-BD-16
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.016" (0.41mm) 0.440" (11.18mm) Unplated - Adhesive
28-49U-BD-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.28 X 0.49 BD 16--28-49U-BD-16-
- -55°C ~ 121°C Fingerstock Beryllium Copper - 0.280" (7.11mm) 0.490" (12.44mm) Unplated - Adhesive