- Series：
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- Operating Temperature：
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- Material：
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- Height：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Condizioni selezionate:
Scopri i prodotti 422
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|
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|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,ZNC,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.150" (3.81mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,BF
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.280" (7.11mm) | - | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.210" (5.33mm) | Tin | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.150" (3.81mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.280" (7.11mm) | 0.330" (8.38mm) | Tin | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,SNSAT
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.270" (6.86mm) | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,NID
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.270" (6.86mm) | 0.380" (9.65mm) | Nickel | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.270" (6.86mm) | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,ZNC
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.270" (6.86mm) | 0.380" (9.65mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.270" (6.86mm) | 0.380" (9.65mm) | Tin | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,NIB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.270" (6.86mm) | 0.380" (9.65mm) | Nickel | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,NID
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.350" (8.89mm) | 0.330" (8.38mm) | Nickel | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,SNB
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.350" (8.89mm) | 0.330" (8.38mm) | Tin | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,NIE,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.030" (0.76mm) | 0.150" (3.81mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,CLO
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.140" (3.56mm) | 0.210" (5.33mm) | Tin | 299.21μin (7.60μm) | Clip | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
LS,STR,BF,PSA
|
- | - | - | - | - | - | 0.180" (4.57mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,ZNC,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 0.250" (6.35mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 0.250" (6.35mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.080" (2.03mm) | 0.250" (6.35mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,ZNC,PSA
|
Foldover | 121°C | Fingerstock | Beryllium Copper | - | 0.120" (3.05mm) | 0.380" (9.65mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive |
