- Series：
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- Operating Temperature：
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- Shape：
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- Plating - Thickness：
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- Attachment Method：
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- Condizioni selezionate:
Scopri i prodotti 22
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Width | Plating | Plating - Thickness | Attachment Method | |
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 19.81X609.6MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,BF
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | - | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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AP,STR,SNSAT,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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AP,STR,SNB,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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AP,STR,NIE,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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AP COIL BF PSA
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All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Unplated | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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AP,STR,CDY,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Zinc + Yellow Chromate | 299.21μin (7.60μm) | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SNPB,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Lead，Tin | 299.21μin (7.60μm) | Adhesive | ||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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.250"H X .375"W X 24"L--D SHAPED
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | D-Shape | 0.375" (9.53mm) | - | - | - | |||
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Laird Technologies EMI |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,BF,USF,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | - | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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0.25 X 1.09 BD 24--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 1.090" (27.69mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
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- |
-
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MOQ: 1 MPQ: 1
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0.25 X 1.09 NI 24--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 1.090" (27.69mm) | Nickel | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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0.25 X 0.78 X 0.50 BD 24--FOLDED
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 0.78 X 0.50 BD 24--FOLDED
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
|
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Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
|
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Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.25 X 0.78 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 1.09 SN 24--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 1.090" (27.69mm) | Tin | Flash | Adhesive | |||
|
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 0.78 X 0.50 SN 24--FOLDED
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Tin | Flash | Adhesive | |||
|
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 0.78 SN 24--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Tin | Flash | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.25 X 0.78 SU 24--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.780" (19.81mm) | Unplated | - | Adhesive |
