- Operating Temperature：
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- Type：
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- Material：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Condizioni selezionate:
Scopri i prodotti 27
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Height | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Height | Plating | Plating - Thickness | Attachment Method | |
|
|
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Laird Technologies EMI |
244
|
3 giorni |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 15.24X609.60MM
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- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | - | - | Adhesive | ||
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|
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Laird Technologies EMI |
447
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU ALLOY 15.24X609.6MM
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No Snag | 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | - | - | Adhesive | ||
|
|
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Laird Technologies EMI |
71
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 15.24X609.6MM
|
- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | - | - | Adhesive | ||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 15.24X609.6MM
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- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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NOSG,STR,BF,USF,PSA
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | - | - | Slot | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
NOSG,STR,SNSAT,PSA
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No Snag | 121°C | Fingerstock | Beryllium Copper | 0.220" (5.59mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,SNB,PSA
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- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,ZNC,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,STR,NIB,PSA
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- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SU,PSA
|
- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | - | - | Adhesive | ||
|
|
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,CDC,PSA
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- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Cadmium + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
HDWE GROUNDING STRIP
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- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.23 X 0.60 SN 24--FOLDED SERIES
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Tin | Flash | Adhesive | |||
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP,COIL,BF,USFT,PSA
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- | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | - | - | Adhesive | |||
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL SNB PSA
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All-Purpose | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Tin | 299.21μin (7.60μm) | Adhesive | |||
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
AP COIL BF USFT PSA
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All-Purpose | 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Unplated | - | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Unplated | - | Adhesive | |||
|
|
Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 BD 24--FOLDED SERIES
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Unplated | - | Adhesive | |||
|
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Leader Tech Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
0.23 X 0.60 BD 24 NTP--FOLDED SE
|
- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | 0.230" (5.84mm) | Unplated | - | Adhesive |
