- Operating Temperature：
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- Material：
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- Shape：
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- Height：
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- Width：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Condizioni selezionate:
Scopri i prodotti 22
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|
|
|
ITT Cannon，LLC |
75,600
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.138" (3.50mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
78,446
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.138" (3.50mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
78,446
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
UNIVERSAL CONTACT 3.5MM SMD
|
- | Shield Finger，Pre-Loaded | Beryllium Copper | - | 0.138" (3.50mm) | 0.043" (1.10mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
Laird Technologies EMI |
4,400
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.118" (3.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
5,230
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.118" (3.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
5,230
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.118" (3.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.197" (5.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
770
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.197" (5.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
770
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.236" (6.00mm) | 0.197" (5.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | Solder | ||
|
|
|
Leader Tech Inc. |
1,800
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.157" (4.00mm) | - | - | - | ||
|
|
|
Leader Tech Inc. |
3,595
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.157" (4.00mm) | - | - | - | ||
|
|
|
Leader Tech Inc. |
3,595
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.118" (3.00mm) | 0.157" (4.00mm) | - | - | - | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.394" (10.00mm) | 0.236" (6.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.394" (10.00mm) | 0.236" (6.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
-40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.394" (10.00mm) | 0.236" (6.00mm) | - | - | Solder | ||
|
|
|
Amphenol FCI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
ANTENNA 3.5H TI CU G/F P
|
- | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | - | 0.138" (3.50mm) | 0.055" (1.40mm) | Gold | Flash | Solder | ||
|
|
|
Amphenol FCI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
3.50MM HEIGHT UNIVERSAL CONTACT
|
- | Shield Finger，Pre-Loaded | Beryllium Copper Alloy | - | 0.138" (3.50mm) | 0.043" (1.10mm) | Gold | Flash | Solder |
