- Series：
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- Operating Temperature：
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- Material：
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- Shape：
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- Height：
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- Attachment Method：
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- Condizioni selezionate:
Scopri i prodotti 18
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Width | Plating | Plating - Thickness | Attachment Method | |
|
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|
ITT Cannon，LLC |
183,600
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.071" (1.80mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
196,508
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.071" (1.80mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
ITT Cannon，LLC |
196,508
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
MICRO UNIVERSAL CONTACT Z 1.8MM
|
- | - | Shield Finger，Pre-Loaded | Titanium Copper | - | 0.071" (1.80mm) | 0.038" (0.96mm) | Nickel | 118.11μin (3.00μm) | Solder | ||
|
|
|
Molex，LLC |
42,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CLIP SPRING ASSY 1.95MM
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.077" (1.95mm) | 0.059" (1.50mm) | Gold | 49.213μin (1.25μm) | Solder | ||
|
|
|
Molex，LLC |
47,725
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CLIP SPRING ASSY 1.95MM
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.077" (1.95mm) | 0.059" (1.50mm) | Gold | 49.213μin (1.25μm) | Solder | ||
|
|
|
Molex，LLC |
47,725
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CLIP SPRING ASSY 1.95MM
|
- | - | Shield Finger，Pre-Loaded | Stainless Steel | - | 0.077" (1.95mm) | 0.059" (1.50mm) | Gold | 49.213μin (1.25μm) | Solder | ||
|
|
|
Harwin Inc. |
30,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.28MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.050" (1.28mm) | 0.039" (1.00mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
37,436
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.28MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.050" (1.28mm) | 0.039" (1.00mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
37,436
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 1.28MM SMD
|
EZ BoardWare | -40°C ~ 85°C | Shield Finger，Pre-Loaded | Copper Alloy | - | 0.050" (1.28mm) | 0.039" (1.00mm) | Gold | Flash | Solder | ||
|
|
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Leader Tech Inc. |
2,100
|
3 giorni |
-
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MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | - | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.098" (2.50mm) | 0.118" (3.00mm) | - | - | - | ||
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|
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Leader Tech Inc. |
4,150
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | - | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.098" (2.50mm) | 0.118" (3.00mm) | - | - | - | ||
|
|
|
Leader Tech Inc. |
4,150
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SURFACE MOUNT GASKET
|
- | - | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.098" (2.50mm) | 0.118" (3.00mm) | - | - | - | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.157" (4.00mm) | 0.157" (4.00mm) | - | - | Solder | ||
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.157" (4.00mm) | 0.157" (4.00mm) | - | - | Solder | ||
|
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Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Rectangle | 0.157" (4.00mm) | 0.157" (4.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | Solder | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
METAL FILM OVER FOAM CONTACTS
|
- | -40°C ~ 70°C | Film Over Foam | Polyurethane Foam，Tin-Copper Polyester (SN/CU) | Hourglass | 0.197" (5.00mm) | 0.197" (5.00mm) | - | - | Solder |
