Scopri i prodotti 19
immagine Numero di parte fabbricante quantità Periodo di consegna Prezzo unitario acquistare descrizione Series Operating Temperature Height Length Plating Plating - Thickness Attachment Method
97043802
Laird Technologies EMI
97
3 giorni
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 27.69MMX406.4MM
- 121°C 0.250" (6.35mm) 16.000" (406.40mm) - - Hardware,Rivet,Solder
0C97043802
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
RFI EMI GROUNDING MATERIAL 25FT
Large Enclosure 121°C 0.250" (6.35mm) 25.000 (7.62m) - - Hardware,Rivet,Solder
0C98043802
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
CSTR COIL BF USF
Large Enclosure 121°C 0.250" (6.35mm) 25.000 (7.60m) Unplated - Adhesive
98064017
Laird Technologies EMI
inchiesta
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MOQ: 1  MPQ: 1
CLO,STR,SNB,USFT
- 121°C 0.260" (6.60mm) 16.000" (406.40mm) Tin 299.21μin (7.60μm) Clip
0C97043817
Laird Technologies EMI
inchiesta
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MOQ: 1  MPQ: 1
CSTR COIL SNB
Large Enclosure 121°C 0.250" (6.35mm) 25.000 (7.60m) Tin 299.21μin (7.60μm) Hardware,Rivet,Solder
0C97043818
Laird Technologies EMI
inchiesta
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-
MOQ: 1  MPQ: 1
CSTR COIL NIE
Large Enclosure 121°C 0.250" (6.35mm) 25.000 (7.60m) Nickel 299.21μin (7.60μm) Hardware,Rivet,Solder
0C97043819
Laird Technologies EMI
inchiesta
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MOQ: 1  MPQ: 1
CSTR COIL NIB
Large Enclosure 121°C 0.250" (6.35mm) 25.000 (7.60m) Nickel 299.21μin (7.60μm) Hardware,Rivet,Solder
25-109FSDS-BD-24
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.25 X 1.09 BD 24--FOLDED SERIES
- -55°C ~ 121°C 0.250" (6.35mm) 24.000" (609.60mm) Unplated - Adhesive
25-109FSDS-NI-24
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.25 X 1.09 NI 24--FOLDED SERIES
- -55°C ~ 121°C 0.250" (6.35mm) 24.000" (609.60mm) Nickel Flash Adhesive
25-109C-070-BD-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.25 X 1.09 X 070 BD 16--25-109C
- -55°C ~ 121°C 0.250" (6.35mm) 16.000" (406.40mm) Unplated - Adhesive
25-109C-120-BD-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.25 X 1.09 X 120 BD 16--25-109C
- -55°C ~ 121°C 0.250" (6.35mm) 16.000" (406.40mm) Unplated - Adhesive
25-109C-130-BD-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.25 X 1.09 X 130 BD 16--25-109C
- -55°C ~ 121°C 0.250" (6.35mm) 16.000" (406.40mm) Unplated - Adhesive
25-109FSDS-SN-24
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.25 X 1.09 SN 24--FOLDED SERIES
- -55°C ~ 121°C 0.250" (6.35mm) 24.000" (609.60mm) Tin Flash Adhesive
0C97043816
Laird Technologies EMI
inchiesta
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MOQ: 1  MPQ: 1
CSTR COIL ZNY
Large Enclosure 121°C 0.250" (6.35mm) 25.000 (7.62m) Zinc + Yellow Chromate 299.21μin (7.60μm) Hardware,Rivet,Solder
25-109C-120-NI-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.25 X 1.09 X 120 NI 16--25-109C
- -55°C ~ 121°C 0.250" (6.35mm) 16.000" (406.40mm) Nickel Flash Adhesive
25-109C-130-SN-16
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.25 X 1.09 X 130 SN 16--25-109C
- -55°C ~ 121°C 0.250" (6.35mm) 16.000" (406.40mm) Tin Flash Adhesive
25-109FSDS-SU-300
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.25 X 1.09 SU 300"--FOLDED SERI
- -55°C ~ 121°C 0.250" (6.35mm) 25.00 (7.62m) Unplated - Adhesive
25-109FSDS-SN-300""
Leader Tech Inc.
inchiesta
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MOQ: 1  MPQ: 1
0.25 X 1.09 SN 300"--FOLDED SERI
- -55°C ~ 121°C 0.250" (6.35mm) 25.00 (7.62m) Tin Flash Adhesive
25-109FSDS-BD-300
Leader Tech Inc.
inchiesta
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-
MOQ: 1  MPQ: 1
0.25 X 1.09 BD 300"--FOLDED SERI
- -55°C ~ 121°C 0.250" (6.35mm) 25.00 (7.62m) Unplated - Adhesive