- Operating Temperature：
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- Condizioni selezionate:
Scopri i prodotti 24
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Attachment Method | |
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|
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Laird Technologies EMI |
328
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 7.11X406.4MM
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- | - | - | - | - | - | 16.000" (406.40mm) | - | - | ||
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|
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Laird Technologies EMI |
102
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X406.4MM
|
- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | - | Adhesive | ||
|
|
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Laird Technologies EMI |
55
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3 giorni |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X609.6MM
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No Snag | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 24.000" (609.60mm) | - | Adhesive | ||
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|
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Leader Tech Inc. |
76
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3 giorni |
-
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MOQ: 1 MPQ: 1
|
FSG，.252"H X .280"W X 48"L
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- | - | Fabric Over Foam | - | C-Fold | 0.252" (6.40mm) | 48.000" (121.90cm) | - | - | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 7.11X4.32MM
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.169" (4.29mm) | - | Slot | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 7.11X9.04MM
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.356" (9.04mm) | - | Slot | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 7.11X13.82MM
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.543" (13.79mm) | - | Slot | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
GASKET BECU 7.11X18.54MM
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Slot Mount | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 0.730" (18.54mm) | - | Slot | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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GASKET BECU 7.11X406.4MM
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.055" (1.40mm) | 16.000" (406.40mm) | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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RFI EMI GROUNDING MATERIAL 25FT
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Unplated | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
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AP COIL BF
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All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,BF
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | - | Adhesive | ||
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|
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,SU,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | - | Adhesive | ||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
AP COIL BF USFT PSA
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All-Purpose | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Unplated | Adhesive | |||
|
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Leader Tech Inc. |
10
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
EMI FABRIC GASKET 1.52X7.11MM
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Ripstop (NI/CU) | Rectangular | 0.060" (1.52mm) | 23.62" (599.95mm) | - | Non-Conductive Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.28 BD 16--11-28RH-BD-16
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Unplated | Adhesive | |||
|
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.28 BD 16--11-S-28RH-BD-
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Unplated | Adhesive | |||
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
.060"H X .280"W X 48"L--RECTANGU
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- | -40°C ~ 70°C | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Polyester (NI/CU) | Rectangular | 0.060" (1.52mm) | 4.00 (1.22m) | - | - | |||
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Laird Technologies EMI |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
AP,STR,BF,USF,PSA
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- | 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | - | Adhesive | |||
|
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Leader Tech Inc. |
inchiesta
|
- |
-
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MOQ: 1 MPQ: 1
|
0.11 X 0.28 X 0.23 BD 16--FOLDED
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- | -55°C ~ 121°C | Fingerstock | Beryllium Copper | - | 0.110" (2.79mm) | 16.000" (406.40mm) | Unplated | Adhesive |
