- Series:
-
- Plating - Thickness:
-
- Attachment Method:
-
- Condizioni selezionate:
Scopri i prodotti 20
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Height | Plating | Plating - Thickness | Attachment Method | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Height | Plating | Plating - Thickness | Attachment Method | ||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 9.65X406.4MM
|
- | 0.270" (6.86mm) | - | - | Clip | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 9.65X406.4MM
|
- | 0.200" (5.08mm) | - | - | Clip | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.65X406.4MM
|
Foldover | 0.120" (3.05mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
1
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 9.65X406.4MM
|
- | 0.270" (6.86mm) | - | - | Clip | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
GASKET BECU 9.65X406.4MM
|
Foldover | 0.120" (3.05mm) | Nickel | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL BF PSA
|
Foldover | 0.120" (3.05mm) | Unplated | - | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,BF,USFT
|
Clip-On | 0.200" (5.08mm) | - | - | Clip | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,BF,USF
|
Clip-On | 0.200" (5.08mm) | - | - | Clip | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,SNSAT
|
- | 0.270" (6.86mm) | Tin | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,NID
|
- | 0.270" (6.86mm) | Nickel | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,TLN,SNB
|
- | 0.270" (6.86mm) | Tin | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,ZNC
|
- | 0.270" (6.86mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,SNB
|
- | 0.270" (6.86mm) | Tin | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CLO,STR,DLN,NIB
|
- | 0.270" (6.86mm) | Nickel | 299.21μin (7.60μm) | Clip | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,ZNC,PSA
|
Foldover | 0.120" (3.05mm) | Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,PSA
|
Foldover | 0.120" (3.05mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG COIL SNB PSA
|
Foldover | 0.120" (3.05mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,BF,USF,PSA
|
Foldover | 0.120" (3.05mm) | - | - | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,SNB,USF,PSA
|
Foldover | 0.120" (3.05mm) | Tin | 299.21μin (7.60μm) | Adhesive | ||||
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
NOSG,STR,NIB,USF,PSA
|
Foldover | 0.120" (3.05mm) | Nickel | 299.21μin (7.60μm) | Adhesive |