- Series：
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- Operating Temperature：
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- Material：
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- Shape：
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- Height：
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- Length：
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- Plating：
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- Plating - Thickness：
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- Attachment Method：
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- Condizioni selezionate:
Scopri i prodotti 65
 |
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Series | Operating Temperature | Type | Material | Shape | Height | Length | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Wurth Electronics Inc. |
4,800
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.276" (7.00mm) | 0.244" (6.20mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
5,349
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.276" (7.00mm) | 0.244" (6.20mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
5,349
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.276" (7.00mm) | 0.244" (6.20mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.138" (3.50mm) | 0.177" (4.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,916
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.138" (3.50mm) | 0.177" (4.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
1,916
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
WE-SECF SMD EMI CONTACT FINGER
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.138" (3.50mm) | 0.177" (4.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
600
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.512" (13.00mm) | 0.276" (7.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
888
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.512" (13.00mm) | 0.276" (7.00mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
888
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.512" (13.00mm) | 0.276" (7.00mm) | Gold | Flash | Solder | ||
|
|
|
Laird Technologies EMI |
849
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
GSKT FAB/FOAM 2.5X457.2MM DSHAPE
|
- | - | Fabric Over Foam | Polyurethane Foam，Nickel-Copper Taffeta (NI/CU) | D-Shape | 0.059" (1.50mm) | 18.000" (457.20mm) | - | - | Adhesive | ||
|
|
|
Harwin Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.106" (2.70mm) | 0.150" (3.80mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
400
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.106" (2.70mm) | 0.150" (3.80mm) | Gold | Flash | Solder | ||
|
|
|
Harwin Inc. |
400
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
RFI SHIELD FINGER AU 2.7MM SMD
|
EZ BoardWare | -55°C ~ 125°C | Shield Finger | Copper Alloy | - | 0.106" (2.70mm) | 0.150" (3.80mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.157" (4.00mm) | 0.138" (3.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.157" (4.00mm) | 0.138" (3.50mm) | Gold | Flash | Solder | ||
|
|
|
Wurth Electronics Inc. |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
CONTACT FINGER EMI SMD
|
WE-SECF | -40°C ~ 100°C | Shield Finger | Beryllium Copper | - | 0.157" (4.00mm) | 0.138" (3.50mm) | Gold | Flash | Solder | ||
|
|
TE Connectivity AMP Connectors |
30,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 3025-Z1-T
|
- | - | Shield Finger | Titanium Copper | - | 0.118" (3.00mm) | 0.177" (4.50mm) | Gold | 2μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
33,438
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SHIELD FINGER 3025-Z1-T
|
- | - | Shield Finger | Titanium Copper | - | 0.118" (3.00mm) | 0.177" (4.50mm) | Gold | 2μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
20,000
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER3525Z
|
- | - | Shield Finger | Copper Alloy | - | 0.138" (3.50mm) | 0.177" (4.50mm) | Gold | 1.967μin (0.05μm) | Solder | |||
|
|
TE Connectivity AMP Connectors |
20,581
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
SHIELDFINGER3525Z
|
- | - | Shield Finger | Copper Alloy | - | 0.138" (3.50mm) | 0.177" (4.50mm) | Gold | 1.967μin (0.05μm) | Solder |
