Contatti, Fingerstock e Guarnizioni - Zui Ai Technology（Taiwan）Company.

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immagine	Numero di parte	fabbricante	quantità	Periodo di consegna	Prezzo unitario	acquistare	descrizione	Series	Operating Temperature	Type	Material	Shape	Height	Length	Plating	Attachment Method
immagine	Numero di parte	fabbricante	quantità	Periodo di consegna	Prezzo unitario	acquistare	descrizione	Series	Operating Temperature	Type	Material	Shape	Height	Length	Plating	Attachment Method
	97061102	Laird Technologies EMI	192	3 giorni	-	FINGERSTOCK BECU 7.57X406.4MM MOQ: 1 MPQ: 1	FINGERSTOCK BECU 7.57X406.4MM	-	121°C	Fingerstock	Beryllium Copper	-	0.170" (4.32mm)	16.000" (406.40mm)	-	Clip
	97061302	Laird Technologies EMI	36	3 giorni	-	FINGRSTCK BECU ALY 7.57X406.4MM MOQ: 1 MPQ: 1	FINGRSTCK BECU ALY 7.57X406.4MM	-	121°C	Fingerstock	Beryllium Copper	-	0.100" (2.54mm)	16.000" (406.40mm)	-	Clip
	97055902	Laird Technologies EMI	22	3 giorni	-	FINGRSTOCK BECU ALY 7.57X609.6MM MOQ: 1 MPQ: 1	FINGRSTOCK BECU ALY 7.57X609.6MM	Twist	121°C	Fingerstock	Beryllium Copper	-	0.070" (1.78mm)	24.000" (609.60mm)	-	Adhesive
	97061002	Laird Technologies EMI	inchiesta	-	-	FINGERSTCK BECU ALY 7.57X406.4MM MOQ: 1 MPQ: 1	FINGERSTCK BECU ALY 7.57X406.4MM	-	121°C	Fingerstock	Beryllium Copper	-	0.100" (2.54mm)	16.000" (406.40mm)	-	Clip
	97061402	Laird Technologies EMI	inchiesta	-	-	FINGRSTCK BECU ALY 7.57X406.4MM MOQ: 1 MPQ: 1	FINGRSTCK BECU ALY 7.57X406.4MM	-	121°C	Fingerstock	Beryllium Copper	-	0.100" (2.54mm)	16.000" (406.40mm)	-	Clip
	0C97055902	Laird Technologies EMI	inchiesta	-	-	RFI EMI GROUNDING MATERIAL 25FT MOQ: 1 MPQ: 1	RFI EMI GROUNDING MATERIAL 25FT	Twist	121°C	Fingerstock	Beryllium Copper	-	0.070" (1.78mm)	24.000" (609.60mm)	Unplated	Adhesive
	0C98055902	Laird Technologies EMI	inchiesta	-	-	RFI EMI GROUNDING MATERIAL 25FT MOQ: 1 MPQ: 1	RFI EMI GROUNDING MATERIAL 25FT	Twist	121°C	Fingerstock	Beryllium Copper	-	0.070" (1.78mm)	24.000" (609.60mm)	Unplated	Adhesive
	6-30T-BD-24	Leader Tech Inc.	243	3 giorni	-	COPPER BERYLLIUM FINGERSTOCK EMI MOQ: 1 MPQ: 1	COPPER BERYLLIUM FINGERSTOCK EMI	-	-	Fingerstock	Beryllium Copper	-	0.070" (1.78mm)	24.000" (609.60mm)	-	-
	98061102	Laird Technologies EMI	inchiesta	-	-	CLO,STR,TLN,BF,USF MOQ: 1 MPQ: 1	CLO,STR,TLN,BF,USF	Clip-On	121°C	Fingerstock	Beryllium Copper	-	0.100" (2.54mm)	16.000" (406.40mm)	-	Clip
	98061302	Laird Technologies EMI	inchiesta	-	-	CLO,STR,DLN,BF,USF MOQ: 1 MPQ: 1	CLO,STR,DLN,BF,USF	Clip-On	121°C	Fingerstock	Beryllium Copper	-	0.100" (2.54mm)	16.000" (406.40mm)	-	Clip
	98055902	Laird Technologies EMI	inchiesta	-	-	TWT,STR,BF,USF,PSA MOQ: 1 MPQ: 1	TWT,STR,BF,USF,PSA	Twist	121°C	Fingerstock	Beryllium Copper	-	0.070" (1.78mm)	24.000" (609.60mm)	-	Adhesive
	10-30C-045-BD-16	Leader Tech Inc.	inchiesta	-	-	0.10 X 0.30 X 0.045 BD 16--10-30 MOQ: 1 MPQ: 1	0.10 X 0.30 X 0.045 BD 16--10-30	TechMESH	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.100" (2.54mm)	16.000" (406.40mm)	Unplated	Adhesive
	10-30C-050-BD-16	Leader Tech Inc.	inchiesta	-	-	0.10 X 0.30 X 050 BD 16--10-30C- MOQ: 1 MPQ: 1	0.10 X 0.30 X 050 BD 16--10-30C-	TechMESH	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.100" (2.54mm)	16.000" (406.40mm)	Unplated	Adhesive
	10-30C-065-BD-16	Leader Tech Inc.	inchiesta	-	-	0.10 X 0.30 X 065 BD 16--10-30C- MOQ: 1 MPQ: 1	0.10 X 0.30 X 065 BD 16--10-30C-	TechMESH	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.100" (2.54mm)	16.000" (406.40mm)	Unplated	Adhesive
	10-30C-070-BD-16	Leader Tech Inc.	inchiesta	-	-	0.10 X 0.30 X 070 BD 16--10-30C- MOQ: 1 MPQ: 1	0.10 X 0.30 X 070 BD 16--10-30C-	TechMESH	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.100" (2.54mm)	16.000" (406.40mm)	Unplated	Adhesive
	10-30C-045-DL-BD-16	Leader Tech Inc.	inchiesta	-	-	0.10 X 0.30 X 045 DL BD 16--10-3 MOQ: 1 MPQ: 1	0.10 X 0.30 X 045 DL BD 16--10-3	TechMESH	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.100" (2.54mm)	16.000" (406.40mm)	Unplated	Adhesive
	10-30C-050-DL-BD-16	Leader Tech Inc.	inchiesta	-	-	0.10 X 0.30 X 050 DL BD 16--10-3 MOQ: 1 MPQ: 1	0.10 X 0.30 X 050 DL BD 16--10-3	TechMESH	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.100" (2.54mm)	16.000" (406.40mm)	Unplated	Adhesive
	10-30C-065-DL-BD-16	Leader Tech Inc.	inchiesta	-	-	0.10 X 0.30 X 065 BD 16--10-30C- MOQ: 1 MPQ: 1	0.10 X 0.30 X 065 BD 16--10-30C-	TechMESH	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.100" (2.54mm)	16.000" (406.40mm)	Unplated	Adhesive
	10-30C-070-DL-BD-16	Leader Tech Inc.	inchiesta	-	-	0.10 X 0.30 X 070 BD 16--10-30C- MOQ: 1 MPQ: 1	0.10 X 0.30 X 070 BD 16--10-30C-	TechMESH	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.100" (2.54mm)	16.000" (406.40mm)	Unplated	Adhesive
	4-34D-BD-16	Leader Tech Inc.	inchiesta	-	-	0.04 X 0.34 BD 16--4-34D-BD-16-- MOQ: 1 MPQ: 1	0.04 X 0.34 BD 16--4-34D-BD-16--	-	-55°C ~ 121°C	Fingerstock	Beryllium Copper	-	0.040" (1.02mm)	16.000" (406.40mm)	Unplated	Adhesive