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Scopri i prodotti 2,862
immagine Numero di parte fabbricante quantità Periodo di consegna Prezzo unitario acquistare descrizione Operating Temperature Type Material Shape Height Length Width Plating Plating - Thickness Attachment Method
97095502
Laird Technologies EMI
74
3 giorni
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 11.43X381MM
121°C Fingerstock Beryllium Copper - 0.140" (3.56mm) 15.000" (381.00mm) 0.450" (11.43mm) - - Rivet
97091302
Laird Technologies EMI
94
3 giorni
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 15.82X381MM
- - - - - 15.000" (381.00mm) 0.623" (15.82mm) - - -
97051002
Laird Technologies EMI
71
3 giorni
-
MOQ: 1  MPQ: 1
GASKET BECU 15.24X609.6MM
121°C Fingerstock Beryllium Copper - 0.230" (5.84mm) 24.000" (609.60mm) 0.600" (15.24mm) - - Adhesive
120220-0206
ITT Cannon,LLC
inchiesta
-
-
MOQ: 1  MPQ: 1
UNIVERSAL CONTACT 4MM SMD
- Shield Finger,Pre-Loaded Beryllium Copper - 0.157" (4.00mm) 0.194" (4.92mm) 0.043" (1.10mm) Nickel 118.11μin (3.00μm) Solder
120220-0206
ITT Cannon,LLC
inchiesta
-
-
MOQ: 1  MPQ: 1
UNIVERSAL CONTACT 4MM SMD
- Shield Finger,Pre-Loaded Beryllium Copper - 0.157" (4.00mm) 0.194" (4.92mm) 0.043" (1.10mm) Nickel 118.11μin (3.00μm) Solder
120220-0206
ITT Cannon,LLC
inchiesta
-
-
MOQ: 1  MPQ: 1
UNIVERSAL CONTACT 4MM SMD
- Shield Finger,Pre-Loaded Beryllium Copper - 0.157" (4.00mm) 0.194" (4.92mm) 0.043" (1.10mm) Nickel 118.11μin (3.00μm) Solder
67SLG050060050PI00
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
METAL FILM OVER FOAM CONTACTS
-40°C ~ 70°C Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Rectangle 0.236" (6.00mm) 0.197" (5.00mm) 0.197" (5.00mm) - - Solder
67SLG050060050PI00
Laird Technologies EMI
770
3 giorni
-
MOQ: 1  MPQ: 1
METAL FILM OVER FOAM CONTACTS
-40°C ~ 70°C Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Rectangle 0.236" (6.00mm) 0.197" (5.00mm) 0.197" (5.00mm) - - Solder
67SLG050060050PI00
Laird Technologies EMI
770
3 giorni
-
MOQ: 1  MPQ: 1
METAL FILM OVER FOAM CONTACTS
-40°C ~ 70°C Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Rectangle 0.236" (6.00mm) 0.197" (5.00mm) 0.197" (5.00mm) - - Solder
67SLG060080070PI00
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
METAL FILM OVER FOAM CONTACTS
-40°C ~ 70°C Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Rectangle 0.315" (8.00mm) 0.276" (7.00mm) 0.236" (6.00mm) - - Solder
67SLG060080070PI00
Laird Technologies EMI
350
3 giorni
-
MOQ: 1  MPQ: 1
METAL FILM OVER FOAM CONTACTS
-40°C ~ 70°C Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Rectangle 0.315" (8.00mm) 0.276" (7.00mm) 0.236" (6.00mm) - - Solder
67SLG060080070PI00
Laird Technologies EMI
350
3 giorni
-
MOQ: 1  MPQ: 1
METAL FILM OVER FOAM CONTACTS
-40°C ~ 70°C Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Rectangle 0.315" (8.00mm) 0.276" (7.00mm) 0.236" (6.00mm) - - Solder
4C13PA51H01800
Laird Technologies EMI
464
3 giorni
-
MOQ: 1  MPQ: 1
GASKET FAB/FOAM 5X457.2MM DSHAPE
- Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) D-Shape 0.197" (5.00mm) 18.000" (457.20mm) 0.197" (5.00mm) - - Adhesive
4212PA22101800
Laird Technologies EMI
67
3 giorni
-
MOQ: 1  MPQ: 1
GASKET FAB/FOAM 4.95X457.2MM SQ
- Fabric Over Foam - Square 0.197" (5.00mm) 18.000" (457.20mm) 0.197" (5.00mm) - - Adhesive
4055PA51H01800
Laird Technologies EMI
42
3 giorni
-
MOQ: 1  MPQ: 1
GASKT FABRIC/FOAM 8X457.2MM RECT
- Fabric Over Foam Polyurethane Foam,Nickel-Copper Taffeta (NI/CU) Rectangle 0.157" (4.00mm) 18.000" (457.20mm) 0.315" (8.00mm) - - Adhesive
4164PA51G01800
Laird Technologies EMI
26
3 giorni
-
MOQ: 1  MPQ: 1
GASKET FAB/FOAM 19.1X457.2MM REC
- Fabric Over Foam - Rectangle 0.059" (1.50mm) 18.000" (457.20mm) 0.752" (19.10mm) - - Adhesive
97043802
Laird Technologies EMI
97
3 giorni
-
MOQ: 1  MPQ: 1
FINGERSTOCK BECU 27.69MMX406.4MM
121°C Fingerstock Beryllium Copper - 0.250" (6.35mm) 16.000" (406.40mm) 1.090" (27.69mm) - - Hardware,Rivet,Solder
67SLH050050050PI00
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
METAL FILM OVER FOAM CONTACTS
-40°C ~ 70°C Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Hourglass 0.197" (5.00mm) 0.197" (5.00mm) 0.197" (5.00mm) - - Solder
67SLH050050050PI00
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
METAL FILM OVER FOAM CONTACTS
-40°C ~ 70°C Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Hourglass 0.197" (5.00mm) 0.197" (5.00mm) 0.197" (5.00mm) - - Solder
67SLH050050050PI00
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
METAL FILM OVER FOAM CONTACTS
-40°C ~ 70°C Film Over Foam Polyurethane Foam,Tin-Copper Polyester (SN/CU) Hourglass 0.197" (5.00mm) 0.197" (5.00mm) 0.197" (5.00mm) - - Solder