- Plating - Thickness：
-
- Attachment Method：
-
- Condizioni selezionate:
Scopri i prodotti 17
 |
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Plating | Plating - Thickness | Attachment Method | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
immagine | Numero di parte | fabbricante | quantità | Periodo di consegna | Prezzo unitario | acquistare | descrizione | Plating | Plating - Thickness | Attachment Method | |
|
|
|
Laird Technologies EMI |
162
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.64X609.6MM
|
Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
63
|
3 giorni |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTOCK BECU 8.64X609.6MM
|
- | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
RFI EMI GROUNDING MATERIAL 25FT
|
Unplated | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,ZNC,PSA
|
Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,NIB,PSA
|
Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,USFT
|
- | - | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,NIE,PSA
|
Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNSAT,USFT,PSA
|
Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,ZNC,USFT,PSA
|
Zinc + Clear Chromate | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,NIB,USFT,PSA
|
Nickel | 299.21μin (7.60μm) | Adhesive | ||
|
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT,STR,SNB,PSA
|
Tin | 299.21μin (7.60μm) | Adhesive | ||
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNSAT PSA
|
Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNB PSA
|
Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNSAT USFT PSA
|
Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL SNB USF PSA
|
Tin | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
TWT COIL NIE PSA
|
Nickel | 299.21μin (7.60μm) | Adhesive | |||
|
|
Laird Technologies EMI |
inchiesta
|
- |
-
|
MOQ: 1 MPQ: 1
|
FINGERSTCK ULTRASFT 8.64X609.6MM
|
- | - | - |
