Scopri i prodotti 6
immagine Numero di parte fabbricante quantità Periodo di consegna Prezzo unitario acquistare descrizione Material Height Length Plating Attachment Method
BMI-C-002
Laird Technologies EMI
inchiesta
-
-
MOQ: 1  MPQ: 1
CONTACT RETAINER FOR BOARDSHIELD
Beryllium Copper 0.100" (2.54mm) 0.374" (9.50mm) Gold Solder
BMI-C-002
Laird Technologies EMI
3,499
3 giorni
-
MOQ: 1  MPQ: 1
CONTACT RETAINER FOR BOARDSHIELD
Beryllium Copper 0.100" (2.54mm) 0.374" (9.50mm) Gold Solder
BMI-C-002
Laird Technologies EMI
3,499
3 giorni
-
MOQ: 1  MPQ: 1
CONTACT RETAINER FOR BOARDSHIELD
Beryllium Copper 0.100" (2.54mm) 0.374" (9.50mm) Gold Solder
TC-01
Leader Tech Inc.
22,000
3 giorni
-
MOQ: 1  MPQ: 1
SMS,TECH CLIP--PCB--SHIELD COVER
Phosphor Bronze 0.137" (3.48mm) 0.310" (7.87mm) Tin -
TC-01
Leader Tech Inc.
23,160
3 giorni
-
MOQ: 1  MPQ: 1
SMS,TECH CLIP--PCB--SHIELD COVER
Phosphor Bronze 0.137" (3.48mm) 0.310" (7.87mm) Tin -
TC-01
Leader Tech Inc.
23,160
3 giorni
-
MOQ: 1  MPQ: 1
SMS,TECH CLIP--PCB--SHIELD COVER
Phosphor Bronze 0.137" (3.48mm) 0.310" (7.87mm) Tin -